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For gol Found Datasheets File :: 141 Search Time::2.031ms
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				AMPHENOL CORP
Part No.	CAD06W7262
OCR Text	... contact: 0. 38 micron min gol d plate ing at mating area, 1.27 - 2.54 micron matte tin at solder tail, 1.27 - 2.54 micronnickel under plated. wing: 2.0 micron bright tin and 1.27 - 2.54 micron nickel under plate ...
Description	PCB CONNECTOR
File Size	51.80K / 1 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	VBUS05A1-SD0-G4-08
OCR Text	...g the electroless ni/immersion gol d over copper pad plating. 3. screen print process the solder paste is applied to the pcb by using a screen print process. the recommended stencil thickness for the clp0603 package is 80 m (the absolut...
Description	Low Capacitance Bidirectional Symmetrical (BiSy) Single Line ESD-Protection Diode in Silicon Package
File Size	216.69K / 10 Page	View it Online	Download Datasheet

				Anaren Microwave
Part No.	B0322J5050AHF
OCR Text	...e soldering processes. pads are gol d plated with a nickel barrier. an example of the pcb footprint used in the testing of these parts is shown below. in specific designs , the transmission line widths need to b...
Description	Ultra Low Profile 0805 Balun 50 to 50 Balanced
File Size	3,349.01K / 5 Page	View it Online	Download Datasheet

				3M Electronics
Part No.	5733 5280 5281
OCR Text	... materials: lower contacts: gol d plated beryllium copper per qq - c - 533, alloy 172, hm. upper contacts: gold plated phosphor bronze, alloy 510, grade a body: gray, glass - filled nylon ordering information: model 5515a (pl...
Description	Model 5515A PLCC Test Adapters Kit
File Size	91.12K / 2 Page	View it Online	Download Datasheet

				Major League Electronics
Part No.	BLSMBC-1-S
OCR Text	...ating: f - gol d fl a s h over al l lead free packaging: tr = ta pe a nd reel tb = tube
Description	3.0 Ampere, 1000M Ohms Min.
File Size	140.88K / 1 Page	View it Online	Download Datasheet

				Major League Electronics
Part No.	BLTSM-1-SH-S
OCR Text	...ating: f - gol d fl a s h over al l lead free pick and place cap packaging: tr = ta pe a nd reel tb = tube s xx number of pins per row 02,03,04,05,06 lf p xx h f
Description	3.0 Ampere
File Size	138.56K / 1 Page	View it Online	Download Datasheet

				Major League Electronics
Part No.	BLTSM-7-S
OCR Text	...ating: f - gol d fl a s h over al l lead free pick and place cap packaging: tr = ta pe a nd reel tb = tube
Description	1.0 Ampere, 1000M Ohms Min
File Size	136.44K / 1 Page	View it Online	Download Datasheet

				Anaren Microwave
Part No.	B0922N7575AHF
OCR Text	...e soldering processes. pads are gol d plated with a nickel barrier. an example of the pcb footprint used in the testing of these parts is shown below. an example of a dc biased footprint is also shown below. ...
Description	Ultra Low Profile 0404 Balun 75 to 75 Balanced
File Size	3,323.52K / 7 Page	View it Online	Download Datasheet

				Anaren Microwave
Part No.	DC2337J5010AHF
OCR Text	...e soldering processes. pads are gol d plated with a nickel barrier. an example of the pcb footprint used in the testing of these parts is shown below. in specific designs , the transmission line widths need to b...
Description	Ultra Low Profile 0805 10dB Directional Coupler
File Size	251.58K / 8 Page	View it Online	Download Datasheet

For gol Found Datasheets File :: 141 Search Time::2.031ms
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