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  die-19 Datasheet PDF File

For die-19 Found Datasheets File :: 17759    Search Time::1.516ms    
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    ST7LCRDIE6 ST7LCRDIE6_XXX ST7LCRE4U1 ST7LCRE4U1_XXX ST7LCRDIE6/XXX ST7LCRE4U1/XXX

STMicroelectronics
Part No. ST7LCRDIE6 ST7LCRDIE6_XXX ST7LCRE4U1 ST7LCRE4U1_XXX ST7LCRDIE6/XXX ST7LCRE4U1/XXX
OCR Text ...al components Device summary DIE VFQFPN24(Y1) - Programmable smartcard internal voltage regulator (1.8 to 3.0V) with current ov...19 4.7.1 4.7.2 4.7.3 Functional EMS (electromagnetic susceptibility) . . . . . . . . . . . . . . . ...
Description Full-speed USB MCU with smartcard interface

File Size 333.15K  /  29 Page

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    MIMIX[Mimix Broadband]
Part No. XP1012
OCR Text ...uctive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VS...19 dBm -65 to +165 OC -55 to MTTF Table 3 MTTF Table 3 (3) Channel temperature affects a device's...
Description 37.0-40.0 GHz GaAs MMIC Power Amplifier

File Size 154.81K  /  6 Page

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    ADJD-MJ60 ADJD-MJ61 ADJD-MJ50 ADJD-MJ51

AVAGO TECHNOLOGIES LIMITED
Part No. ADJD-MJ60 ADJD-MJ61 ADJD-MJ50 ADJD-MJ51
OCR Text ...d ADJD-MJ51 (Top Emitting) LED die position 1 100.00 97.00 LED die position 50 (4.41) 12.00 18.00 7.29 17.15 14.00 19.00 3D VIEW 19.00 14.00 TOP VIEW Connector Connector Pin 1 Pin 8 34.00 3.60 2.00 15.00 ...
Description High Performance RGB LED Light Source

File Size 382.53K  /  8 Page

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    MIMIX[Mimix Broadband]
Part No. XP1009
OCR Text ...uctive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VS...19 20 21 22 Frequency (GHz) 40 39 38 37 36 35 34 33 32 31 30 29 28 17 18 19 20 21 22 Frequency (G...
Description 17.0-21.0 GHz GaAs MMIC Power Amplifier

File Size 141.70K  /  6 Page

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    FMA30071

Filtronic Compound Semiconductors
Part No. FMA30071
OCR Text ...ronic warfare applications. The die is fabricated using the Filtronic 0.25m process. TYPICAL APPLICATIONS: * * * Test Instrumentation El...19 19 16 4.5 100 3.5 MAX 11.5 12.5 -13 -11 -27 8.5 5.5 150 - UNITS dB dB dB dB dB dBm dBm dB...
Description 2-20GHZ BROADBAND MMIC AMPLIFIER

File Size 604.87K  /  8 Page

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    FMA30081

Filtronic Compound Semiconductors
Part No. FMA30081
OCR Text ...ronic warfare applications. The die is fabricated using the Filtronic 0.25m process. The amplifier is DC blocked at both the input and outpu...19 0.25 39.39 0.25 39.39 0.25 39.39 0.25 39.31 2.38 0.26 35.85 0.26 35.85 0.26 35.85 0.26 35.77 2.57...
Description 2-20GHZ BROADBAND MMIC AMPLIFIER

File Size 657.17K  /  8 Page

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    FMA30091

Filtronic Compound Semiconductors
Part No. FMA30091
OCR Text ...ronic warfare applications. The die is fabricated using the Filtronic 0.25m process. The Circuit is DC blocked at both the RF input and the ...19 26.3 26 21.5 250 Drain Current Noise Figure 8.0V 4 mA 6.5 dB 5 Note: TAMBIENT =...
Description 2-20GHZ BROADBAND MMIC AMPLIFIER

File Size 267.41K  /  10 Page

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