| |
|
 |
Amphenol Communications Solutions |
| Part No. |
78290-136HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68690-136HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
90136-2307 0901362307
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
| File Size |
254.33K /
5 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69190-136HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
90136-1115 0901361115
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
|
| File Size |
159.33K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68422-205H
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0901362330 90136-2330
|
| Description |
2.54mm (.100) Pitch C-Grid III?Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
| File Size |
254.50K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59202-T22-05-044LF
|
| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
470-2205-100
|
| Description |
Receptacle. mod,20Positions, 20.5mm, NEXLEV
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68692-205
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 5 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
90136-2304 0901362304
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
| File Size |
254.43K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
88952-205LF
|
| Description |
Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
90136-2305 0901362305
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
| File Size |
254.43K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68002-205HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 5 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
90136-2302 0901362302
|
| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
| File Size |
254.43K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59112-G28-22-055
|
| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 44 Positions.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
