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  90136-1318 Datasheet PDF File

For 90136-1318 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    TA1318NG

Toshiba Semiconductor
Part No. TA1318NG
Description SYNC Processor, Frequency Counter IC for TV Component Signals

File Size 894.36K  /  41 Page

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Amphenol Communications Solutions

Part No. 131-8214-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Toshiba, Corp.
Part No. TA1318NG
Description Zener Diode; Application: Low noise; Pd (mW): 250; Vz (V): 4.3 to 4.7; Condition Iz at Vz (mA): 0.5; C (pF) max: -; Condition VR at C (V): &#160; ESD (kV) min: -; Package: DO-35 同步处理器,频率计数器集成电路电视分量信

File Size 890.14K  /  41 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Voltage Multipliers, Inc.
Part No. Z15G1318
Description MICROSWITCH ROLLER PLUNGER 微动辊柱

File Size 66.56K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-8218-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    TOSHIBA
Part No. TA1318AF
Description SYNC Processor, Frequency IC for TV Component Signals

File Size 634.19K  /  42 Page

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Amphenol Communications Solutions

Part No. 131-8614-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    C67078-S1318-A2 BUZ78

SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. C67078-S1318-A2 BUZ78
Description SIPMOS Power Transistor (N channel Enhancement mode Avalanche-rated)
SIPMOS ? Power Transistor
From old datasheet system

File Size 194.88K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-8316-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    M/A-COM Technology Solu...
Part No. MADS-001318-1197HP
Description GaAs Flip Chip Schottky Barrier Diodes

File Size 621.45K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-8618-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    MADP-000208-13180W

M/A-COM Technology Solutions, Inc.
Part No. MADP-000208-13180W
Description SURMOUNT TM 8μm PIN Diode Pair RoHS Compliant
SURMOUNT TM 8楼矛m PIN Diode Pair RoHS Compliant

File Size 104.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8414-21H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    2SK118 E001318

Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. 2SK118 E001318
Description N CHANNEL JUNCTION TYPE (GENERAL PURPOSE AND IMPEDANCE CONVERTER AND CONDENSER MICROPHONE APPLICATIONS)
From old datasheet system

File Size 198.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-8316-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    90136-1112 0901361112

Molex Electronics Ltd.
Part No. 90136-1112 0901361112
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8618-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    90136-1208 0901361208

Molex Electronics Ltd.
Part No. 90136-1208 0901361208
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8414-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For 90136-1318 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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