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742A2 M52337SP STRS5708 PT31301 1N3345B JAN2N UPC29S00 ON2699
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  90130-1124 Datasheet PDF File

For 90130-1124 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    0901303318 90130-3318

Molex Electronics Ltd.
Part No. 0901303318 90130-3318
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901303316 90130-3316

Molex Electronics Ltd.
Part No. 0901303316 90130-3316
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901303314 90130-3314

Molex Electronics Ltd.
Part No. 0901303314 90130-3314
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901303312

Molex Electronics Ltd.
Part No. 0901303312
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90130-1230 0901301230

Molex Electronics Ltd.
Part No. 90130-1230 0901301230
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 1,141.29K  /  12 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0901303138

Molex Electronics Ltd.
Part No. 0901303138
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 38 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901303134

Molex Electronics Ltd.
Part No. 0901303134
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 34 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-409241000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-1140 0901301140

Molex Electronics Ltd.
Part No. 90130-1140 0901301140
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 54112-112400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901303110

Molex Electronics Ltd.
Part No. 0901303110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-409481850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901303330 90130-3330

Molex Electronics Ltd.
Part No. 0901303330 90130-3330
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 30 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 77317-112-46LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 46 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

For 90130-1124 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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