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  87914-2816 Datasheet PDF File

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    Samsung Electronic
Part No. K4S28163LD-RFR
Description 2M x 16Bit x 4 Banks SDRAM in 54CSP Data Sheet
File Size 97.04K  /  12 Page

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Amphenol Communications Solutions
Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4M281633F K4M281633F-C K4M281633F-F1L K4M281633F-G K4M281633F-L K4M281633F-N K4M281633F-RE

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4M281633F K4M281633F-C K4M281633F-F1L K4M281633F-G K4M281633F-L K4M281633F-N K4M281633F-RE
Description 2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行54FBGA移动SDRAM
File Size 111.99K  /  12 Page

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Amphenol Communications Solutions
Part No. 54122-816523000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    42820 42817 42818 42815 42816 43914 43915 43938 43980

Molex Electronics Ltd.
Part No. 42820 42817 42818 42815 42816 43914 43915 43938 43980
Description 10.00mm (.393") Pitch Mini-Fit, Sr.垄芒
10.00mm (.393) Pitch Mini-Fit, Sr.?/a>
File Size 153.37K  /  2 Page

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Amphenol Communications Solutions
Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    EVAL-ADN2816EBZ

Analog Devices
Part No. EVAL-ADN2816EBZ
Description Continuous Rate 10 Mb/s to 675 Mb/s Clock and Data Recovery IC
File Size 390.57K  /  24 Page

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Amphenol Communications Solutions
Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    K4S281633D-N1H K4S281633D-N1L K4S281633D-N75 K4S281633D-RL

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S281633D-N1H K4S281633D-N1L K4S281633D-N75 K4S281633D-RL
Description IC REG ULDO DUAL 2.8/1.5V 6-MLF
8Mx16 SDRAM 54CSP
2M x 16Bit x 4 Banks SDRAM in 54CSP Data Sheet
File Size 66.22K  /  10 Page

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Amphenol Communications Solutions
Part No. 68682-816
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Samsung Electronics Inc
Part No. K4S281632F-TC75
Description DRAM (Dynamic RAM) - Datasheet Reference
File Size 107.60K  /  10 Page

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Amphenol Communications Solutions
Part No. 59202-S28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs 　 　

Official Product Page

    3M Company
Part No. K4M28163PD-RS1L K4M28163PD-BS1L
Description 8M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 CSP-54
File Size 64.58K  /  8 Page

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Amphenol Communications Solutions
Part No. 54112-816202500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

   
Part No. DM5516AH-200 DM2816AH-150 DM2816AH-200
Description 2K X 8 EEPROM 5V, 200 ns, CDIP24
2K X 8 EEPROM 5V, 150 ns, CDIP24
File Size 191.36K  /  6 Page

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Amphenol Communications Solutions
Part No. 54122-816202500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

   
Part No. KFG2816U1M-PIB00
Description 8M X 16 FLASH 3.3V PROM, 76 ns, PDSO48
File Size 1,004.64K  /  80 Page

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Amphenol Communications Solutions
Part No. 54242-816062600LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Stacking vertical header, Surface Mount, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Samsung Electronic
Part No. K4S281632E-TC7C K4S281632E-TL7C
Description 2M x 16bit x 4 banks synchronous DRAM LVTTL, 133MHz
File Size 59.25K  /  11 Page

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Amphenol Communications Solutions
Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For 87914-2816 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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