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  87758-1817 Datasheet PDF File

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    0877584617 87758-4617

Molex Electronics Ltd.
Part No. 0877584617 87758-4617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-418-17LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87758-5017 0877585017

Molex Electronics Ltd.
Part No. 87758-5017 0877585017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 89891-817HLF
Description REC VER THT 34pos
Tech specs    

Official Product Page

    0877584616 87758-4616

Molex Electronics Ltd.
Part No. 0877584616 87758-4616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-818-17LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Chipcon
Part No. UCC1817J UCC1817DW
Description 1 A POWER FACTOR CONTROLLER, 250 kHz SWITCHING FREQ-MAX, CDIP16 CERAMIC, DIP-16
1 A POWER FACTOR CONTROLLER, 250 kHz SWITCHING FREQ-MAX, PDSO16 PLASTIC, SOIC-16

File Size 655.95K  /  10 Page

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Amphenol Communications Solutions

Part No. 77315-118-17LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    P1817AF-08SR I1817AF-08TR P1817A-08ST I1817A-08TT P1817B

PulseCore Semiconductor
Part No. P1817AF-08SR I1817AF-08TR P1817A-08ST I1817A-08TT P1817B
Description Low-Power Mobile VGA EMI Reduction IC

File Size 374.66K  /  10 Page

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Amphenol Communications Solutions

Part No. 89891-817H
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 34 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    MAX1817 MAX1817EUB

MAXIM[Maxim Integrated Products]
Part No. MAX1817 MAX1817EUB
Description Compact / High-Efficiency / Dual-Output Step-Up DC-DC Converter
Compact, High-Efficiency, Dual-Output Step-Up DC-DC Converter

File Size 400.00K  /  12 Page

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Amphenol Communications Solutions

Part No. 87061-817LF
Description Quickie®, Wire to Board Connector, Double Row, 68 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 30u\\/0.76um Au/GXT Plating
Tech specs    

Official Product Page

    0877601817

Molex Electronics Ltd.
Part No. 0877601817
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-811181750LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 18 Positions
Tech specs    

Official Product Page

    PL00134-WCRG1817

P-tec Corporation
Part No. PL00134-WCRG1817
Description    4 pin bi-color 0605 Package

File Size 119.76K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-518-17LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    ST2SD1817Z

SEMTECH ELECTRONICS LTD.
Part No. ST2SD1817Z
Description NPN Silicon Epitaxial Planar Transistor

File Size 226.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 71991-817LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 34 Position, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    MAX686 MAX686EEE 1817 MAX686C_D MAX686C/D

Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
Part No. MAX686 MAX686EEE 1817 MAX686C_D MAX686C/D
Description Dual D-type Positive-Edge-Triggered Flip-Flops With Preset And Clear 20-LCCC -55 to 125
DAC-Controlled Boost/Inverter LCD Bias Supply with Internal Switch
From old datasheet system
DAC-Controlled Boost Inverter LCD Bias Supply with Internal Switch

File Size 197.17K  /  16 Page

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Amphenol Communications Solutions

Part No. 77311-118-17LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 87758-1817 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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