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  76155-5608 Datasheet PDF File

For 76155-5608 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-GCCC K4H560438E-GCC4 K4H560438E-GCCC K4H560838E-GCC4
Description DIODE ZENER SINGLE 300mW 27Vz 5mA-Izt 0.02503 0.05uA-Ir 21 SOT-23 3K/REEL 256Mb的电子芯片的DDR 400内存规格60Ball FBGA封装(x4/x8
DIODE ZENER SINGLE 300mW 29.8Vz 5mA-Izt 0.02503 0.05uA-Ir 23 SOT-23 3K/REEL
256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8)

File Size 195.42K  /  18 Page

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Amphenol Communications Solutions

Part No. 10136656-0821LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4T56083QF-GCD5 K4T56083QF-ZCD5 K4T56043QF-GCD5 K4T56043QF-ZCD5
Description 256Mb F-die DDR2 SDRAM
OSC 3.3V SMT 7X5 CMOS 256Mb的的F - DDR2内存芯片

File Size 479.59K  /  27 Page

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Amphenol Communications Solutions

Part No. 10136656-0811LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. K4H560438E-ZLB30 K4H560838E-ZLB30
Description 64M X 4 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60
32M X 8 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60

File Size 385.02K  /  24 Page

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Amphenol Communications Solutions

Part No. 75160-156-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,8 position, 2.54mm pitch
Tech specs    

Official Product Page

    A-7720-WA08F501B 0022456081 22-45-6081

Molex Electronics Ltd.
Part No. A-7720-WA08F501B 0022456081 22-45-6081
Description 2.54mm (.100") KK庐 IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-Through, 22 AWG Wire
2.54mm (.100) KK? IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-Through, 22 AWG Wire

File Size 476.94K  /  20 Page

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Amphenol Communications Solutions

Part No. 10136656-0812LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    A-7720-WD08F501B 0022456087 22-45-6087

Molex Electronics Ltd.
Part No. A-7720-WD08F501B 0022456087 22-45-6087
Description 2.54mm (.100) KK IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-To, 22 AWG Wire

File Size 476.92K  /  20 Page

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Amphenol Communications Solutions

Part No. 10136656-0832NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    A-7720-WC08F501B 0022456086 22-45-6086

Molex Electronics Ltd.
Part No. A-7720-WC08F501B 0022456086 22-45-6086
Description 2.54mm (.100) KK? IDT Double Cantilever Contact, 8 Circuits, Gold (Au), FeedThrough, 22 AWG Wire

File Size 484.66K  /  20 Page

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Amphenol Communications Solutions

Part No. 10136656-0842LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    FAIRCHILD[Fairchild Semiconductor]
Part No. FAN5608_06 FAN5608 FAN5608DHMPX FAN560806
Description Serial / Parallel LED Driver with Current-Regulated, Step-Up DC/DC Converter

File Size 362.35K  /  13 Page

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Amphenol Communications Solutions

Part No. 10136656-0822LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

   
Part No. K9F5608U0C-DIB0 K9F5616U0C-DIB0
Description 32M X 8 FLASH 2.7V PROM, 30 ns, PBGA63
16M X 16 FLASH 2.7V PROM, 30 ns, PBGA63

File Size 728.30K  /  33 Page

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Amphenol Communications Solutions

Part No. 10136656-0832LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H561638F-UC K4H561638F-UC_LB3 K4H560838F-UC_LA2 K4H560838F-UC_LAA K4H560838F-UC_LB0 K4H560838F-UC_LB3 K4H561638F-UC_LA2 K4H561638F-UC_LAA K4H561638F-UC_LB0 K4H560838F-UC/LA2 K4H560838F-UC/LAA K4H560838F-UC/LB0 K4H560838F-UC/LB3 K4H561638F-UC/LA2 K4H561638F-UC/LAA K4H561638F-UC/LB0 K4H561638F-UC/LB3
Description 256Mb F-die DDR SDRAM Specification

File Size 203.61K  /  23 Page

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Amphenol Communications Solutions

Part No. 10136656-0842NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4H560838F K4H561638F-UCCC K4H561638F-UCC4 K4H560838F-UC K4H560838F-UCC4 K4H560838F-UCCC

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4H560838F K4H561638F-UCCC K4H561638F-UCC4 K4H560838F-UC K4H560838F-UCC4 K4H560838F-UCCC
Description 256Mb F-die DDR400 SDRAM Specification 256Mb的的F -模具支持DDR400内存规格

File Size 168.93K  /  19 Page

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Amphenol Communications Solutions

Part No. 10136656-0811NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 8 Positions, Natural Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

For 76155-5608 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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