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  76155-5604 Datasheet PDF File

For 76155-5604 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3

Samsung semiconductor
Part No. K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description 256Mb J-die DDR SDRAM Specification
File Size 352.76K  /  24 Page

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Amphenol Communications Solutions
Part No. 91625-604LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Double Row, Selectively Loaded, 40 Position ,2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II
File Size 196.59K  /  14 Page

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Amphenol Communications Solutions
Part No. 10073456-048LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60
Description 256Mb E-die SDRAM Specification 256Mb的电子芯片内存规
File Size 194.54K  /  14 Page

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Amphenol Communications Solutions
Part No. 10073456-047LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E-UC75 K4S560432E-UL75
Description 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与内存规格4 TSOP-II免费（符合RoHS
File Size 196.27K  /  14 Page

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Amphenol Communications Solutions
Part No. 10073456-044LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, Press-Fit Slimline Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

Official Product Page

    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
Description 16M x 16 SDRAM, LVTTL, 133MHz
256Mb E-die SDRAM Specification 54pin sTSOP-II
File Size 205.22K  /  14 Page

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Amphenol Communications Solutions
Part No. 51740-10405604CCLF
Description PwrBlade®, Power Supply Connectors, 4P 56S 4P Vertical Receptacle.
Tech specs 　 　

Official Product Page

    http://
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438D-GCA2 K4H561638D-GLB3 K4H560838D-GLB3 K4H561638D-GCA2 K4H561638D-GLB0 K4H560438D-GLB0 K4H560438D-GLB3 K4H560838D-GLB0 K4H560838D-GCB3 K4H560838D-GCA2 K4H561638D-GLA2
Description DIODE ZENER SINGLE 200mW 33Vz 0.05mA-Izt 0.05 0.05uA-Ir 25 SOD-323 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 500mW 28Vz 0.05mA-Izt 0.05 0.05uA-Ir 21.2 SOD-123 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 200mW 30Vz 0.05mA-Izt 0.05 0.05uA-Ir 22.8 SOD-323 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 500mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-123 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 150mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-523 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 150mW 33Vz 0.05mA-Izt 0.05 0.05uA-Ir 25 SOD-523 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 200mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-323 3K/REEL
DIODE ZENER SINGLE 200mW 28Vz 0.05mA-Izt 0.05 0.05uA-Ir 21.2 SOD-323 3K/REEL
DIODE ZENER SINGLE 500mW 39Vz 0.05mA-Izt 0.05 0.05uA-Ir 29.6 SOD-123 3K/REEL
DIODE ZENER SINGLE 200mW 39Vz 0.05mA-Izt 0.05 0.05uA-Ir 29.6 SOD-323 3K/REEL
File Size 293.31K  /  26 Page

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Amphenol Communications Solutions
Part No. 10136656-0421LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 4 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    K4H561638D-TC_LB0 K4H560838D-TC_LA0 K4H560838D-TC_LA2 K4H560838D-TC_LB3 K4H560838D-TC_LB0 K4H561638D-TC_LA0 K4H561638D-T

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H561638D-TC_LB0 K4H560838D-TC_LA0 K4H560838D-TC_LA2 K4H560838D-TC_LB3 K4H560838D-TC_LB0 K4H561638D-TC_LA0 K4H561638D-TC_LA2 K4H561638D-TC_LB3 K4H560438D-TC_LB3 K4H560438D-TC K4H560438D-TC_LA0 K4H560438D-TC_LA2 K4H560438D-TC_LB0 K4H561638D-TC/LA2 K4H561638D-TC/LB0 K4H561638D-TC/LA0 K4H561638D-TC/LB3
Description 256MB
File Size 233.83K  /  25 Page

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Amphenol Communications Solutions
Part No. 75160-156-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,4 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    AT91SAM7S2560410

ATMEL Corporation
Part No. AT91SAM7S2560410
Description AT91 ARM Thumb-based Microcontrollers
File Size 223.33K  /  32 Page

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Amphenol Communications Solutions
Part No. 51700-10405604CCLF
Description PwrBlade®, Power Connectors, 4P 56S 4P Vertical Header, Press Fit
Tech specs 　 　

Official Product Page

    K4H561638D-GCB0 K4H561638D-GLB0 K4H561638D-GLB3 K4H560838D-GCB0 K4H560838D-GCB3 K4H560838D-GLA2 K4H560838D-GLB0 K4H56083

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H561638D-GCB0 K4H561638D-GLB0 K4H561638D-GLB3 K4H560838D-GCB0 K4H560838D-GCB3 K4H560838D-GLA2 K4H560838D-GLB0 K4H560838D-GCA2 K4H560838D-GLB3 K4H561638D-GCA2 K4H561638D-GCB3 K4H561638D-GLA2 K4H560438D-GLB3 K4H560438D-GC K4H560438D-GCA2 K4H560438D-GCB0 K4H560438D-GCB3 K4H560438D-GLA2 K4H560438D-GLB0
Description DDR 256MB
File Size 288.19K  /  26 Page

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Amphenol Communications Solutions
Part No. 75844-156-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    K4H560838H-UC/LCC K4H561638H-UC/LCC K4H560438H-UC/LA2 K4H560838H-UC/LA2 K4H561638H-UC/LA2 K4H560438H-UC/LB0 K4H561638H-U

Atmel, Corp.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838H-UC/LCC K4H561638H-UC/LCC K4H560438H-UC/LA2 K4H560838H-UC/LA2 K4H561638H-UC/LA2 K4H560438H-UC/LB0 K4H561638H-UC/LB0 K4H560838H-UC/LB3 K4H561638H-UC/LB3 K4H560838H-UC/LB0 K4H560438H-UCA20 K4H560838H-UCA20 K4H560838H-UCB30
Description 32M X 8 DDR DRAM, 0.7 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
32M X 8 DDR DRAM, 0.75 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
64M X 4 DDR DRAM, 0.75 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
256Mb H-die DDR SDRAM Specification
File Size 361.04K  /  24 Page

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Amphenol Communications Solutions
Part No. 51720-10405604ABLF
Description PwrBlade®, Power Supply Connectors, 4P 56S 4P Right Angle Header.
Tech specs 　 　

Official Product Page

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