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Molex Electronics Ltd. http://
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| Part No. |
0757576121 75757-6121
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| Description |
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5um (100u") Tin (Sn) Plating 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5um (100u) Tin (Sn) Plating
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| File Size |
166.19K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-4214-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd. http://
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| Part No. |
0757576101 75757-6101
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| Description |
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u") Tin (Sn) Plating 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u) Tin (Sn) Plating
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| File Size |
166.22K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-4214-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0252 0757570252
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
78511-421HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68771-421HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76314-213
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| Description |
Dubox® 2.54mm, Board to Board Connector, 26 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0341 0757570341
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
130-3142-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-4218-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0322 0757570322
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
98.95K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-4414-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-1461 0757571461
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
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| File Size |
166.43K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-6214-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-1462 0757571462
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
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| File Size |
166.45K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-7614-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Official Product Page
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