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  75757-1402 Datasheet PDF File

For 75757-1402 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    75757-0121 0757570121

Molex Electronics Ltd.
Part No. 75757-0121 0757570121
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 98.93K  /  3 Page

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Amphenol Communications Solutions

Part No. SE1414023111111
Description Slim Cool Edge 0.65mm, Surface mount, 4 power pins, 140 signal pins, Vertical
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-0332 0757570332

Molex Electronics Ltd.
Part No. 75757-0332 0757570332
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 10061402-10010TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    75757-0231 0757570231

Molex Electronics Ltd.
Part No. 75757-0231 0757570231
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 68771-402HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
Tech specs    

Official Product Page

    75757-0242 0757570242

Molex Electronics Ltd.
Part No. 75757-0242 0757570242
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 10027011-402HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-0252 0757570252

Molex Electronics Ltd.
Part No. 75757-0252 0757570252
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 10069525-141402LF
Description Bergstak® 0.80mm Pitch, Board to Board, Vertical, Plug Assembly, 140 Positions, Dual Row.
Tech specs    

Official Product Page

    75757-0251 0757570251

Molex Electronics Ltd.
Part No. 75757-0251 0757570251
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-141402LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

    75757-0122 0757570122

Molex Electronics Ltd.
Part No. 75757-0122 0757570122
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25um (50u) Nickel (Ni) Overall

File Size 98.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 10139085-121402LF
Description BergStak+™ 0.80mm Mezzanine Connector, Board To Board Connectors, 120 Positions, Dual Row, BTB Vertical Header, P1.
Tech specs    

Official Product Page

    75757-0241 0757570241

Molex Electronics Ltd.
Part No. 75757-0241 0757570241
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25um (50u) Nickel (Ni) Overall

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 10117771-4020HLF
Description Mini-SAS HD Cable Assemblies, High Speed Input Output Connectors, 4X to mini-SAS Cable, Passive, 6Gb/s, 26 AWG, 2.0m, Halogen free jacket.
Tech specs    

Official Product Page

    75757-0222 0757570222

Molex Electronics Ltd.
Part No. 75757-0222 0757570222
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits

File Size 98.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-402-02LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    75757-0221 0757570221

Molex Electronics Ltd.
Part No. 75757-0221 0757570221
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 98.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-402-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 75757-1402 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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