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  75757-1221 Datasheet PDF File

For 75757-1221 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    0757576181 75757-6181

Molex Electronics Ltd.
http://
Part No. 0757576181 75757-6181
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-111221700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 22 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-0421 0757570421

Molex Electronics Ltd.
Part No. 75757-0421 0757570421
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 98.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-110122150LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    75757-0422 0757570422

Molex Electronics Ltd.
Part No. 75757-0422 0757570422
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25um (50u) Nickel (Ni) Overall

File Size 98.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021221-00010T4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 10 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    0757576161 75757-6161

Molex Electronics Ltd.
http://
Part No. 0757576161 75757-6161
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-112081950RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0757576131 75757-6131

Molex Electronics Ltd.
http://
Part No. 0757576131 75757-6131
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.06K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131931-221ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 21 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    0757576121 75757-6121

Molex Electronics Ltd.
http://
Part No. 0757576121 75757-6121
Description 3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5um (100u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5um (100u) Tin (Sn) Plating

File Size 166.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1221PLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    0757576101 75757-6101

Molex Electronics Ltd.
http://
Part No. 0757576101 75757-6101
Description 3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u) Tin (Sn) Plating

File Size 166.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 10136654-1221LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Gold Flash plating, 12 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    75757-1442 0757571442

Molex Electronics Ltd.
Part No. 75757-1442 0757571442
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.5um (60u) Tin (Sn) Plating

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1221LF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    75757-6261 0757576261

Molex Electronics Ltd.
Part No. 75757-6261 0757576261
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021221-00008T4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    75757-6241 0757576241

Molex Electronics Ltd.
Part No. 75757-6241 0757576241
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021221-000A0D8LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 100 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

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