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  73330-0180 Datasheet PDF File

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    1301800333

Molex Electronics Ltd.
Part No. 1301800333
Description MAX-LOC O-Ring, 3/4 NPT

File Size 24.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 10146173-330KLF
Description Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 30 position
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    LF-SPXO018044

List of Unclassifed Manufacturers
Part No. LF-SPXO018044
Description Common frequencies are available from stock. Please see stock list or contact sales office

File Size 42.57K  /  2 Page

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Amphenol Communications Solutions

Part No. 98401-801-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1301800289

Molex Electronics Ltd.
Part No. 1301800289
Description 1/2 Cord Grip Grommet, F2 Body Size 14.27-15.88mm (.562-.625) Cord Diameter

File Size 16.01K  /  1 Page

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Amphenol Communications Solutions

Part No. 98401-801A34LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1301800335

Molex Electronics Ltd.
Part No. 1301800335
Description 1/4 Cord Grip Grommet, F0 Body Size 1.91-3.43mm (.075-.135) Cord Diameter, Black

File Size 29.70K  /  1 Page

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Amphenol Communications Solutions

Part No. 98401-801-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K7N801809A
Description 512Kx18-Bit Pipelined NtRAMData Sheet

File Size 457.06K  /  20 Page

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Amphenol Communications Solutions

Part No. 98401-802-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 08 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0732510180

Molex Electronics Ltd.
Part No. 0732510180
Description 50 Ohms, SMA Flange - Two Hole - Jack Field Replaceable - EMI/RFI Ground Ring

File Size 53.77K  /  1 Page

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Amphenol Communications Solutions

Part No. 98401-801-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K7A401800M

Samsung Electronic
Samsung semiconductor
Part No. K7A401800M
Description 256K x 18-Bit Synchronous Pipelined Burst SRAM Rev. 2.0 (Dec. 1999)
256Kx18 Synchronous SRAM

File Size 399.37K  /  15 Page

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Amphenol Communications Solutions

Part No. 73725-0180BLF
Description USB 2.0, Input Output Connector, Receptacle, Type A, Up Right, Right Angle, Through Hole, Single Deck, 4 Positions
Tech specs    

Official Product Page

    0150200180 15020-0180

Molex Electronics Ltd.
Part No. 0150200180 15020-0180
Description 0.50mm Pitch Premo-Flex FFC Jumper, Opposite Side Contacts (Type D),

File Size 34.66K  /  1 Page

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Amphenol Communications Solutions

Part No. 91601-805ALF
Description DUBOX CARD CONNECTOR
Tech specs    

Official Product Page

    1301800309

Molex Electronics Ltd.
Part No. 1301800309
Description 1 1/4 Cord Grip Grommet, F5 Body Size 22.23-28.58mm (.875-1.000) Cord Diameter

File Size 29.68K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-109401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    K7A201800B

Samsung semiconductor
Part No. K7A201800B
Description 64Kx36 & 64Kx32-Bit Synchronous Pipelined Burst SRAM

File Size 271.80K  /  18 Page

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Amphenol Communications Solutions

Part No. 54122-110701800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 70 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

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