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355709 ISP1507C STI7197 2N6483 153J63 W739R0J 2N4409 P2012D
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  71439-3164 Datasheet PDF File

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    XILINX[Xilinx, Inc]
Part No. XC3195A XC3100A XC3120A XC3130A XC3142A XC3164A XC3190A
Description    Ultra-high-speed FPGA family with six members
Logic Cell Array Families

File Size 62.82K  /  8 Page

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Amphenol Communications Solutions

Part No. 61083-164402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    CD430840A CD431240A CD431640A CD4340A

Powerex Power Semicondu...
Powerex, Inc.
POWEREX[Powerex Power Semiconductors]
Powerex Power Semiconductor...
Part No. CD430840A CD431240A CD431640A CD4340A
Description POW-R-BLOK Dual SCR Isolated Module 40 Amperes / Up to 1600 Volts 63 A, 800 V, SCR
POW-R-BLOK Dual SCR Isolated Module 40 Amperes / Up to 1600 Volts 的POW - r -隔离台BLOk反应腔双可控硅模块四零安高达1600伏特

File Size 99.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6414-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    NTNS3164NZ NTNS3164NZ13 NTNS3164NZT5G

ON Semiconductor
Part No. NTNS3164NZ NTNS3164NZ13 NTNS3164NZT5G
Description Small Signal MOSFET 20 V, 361 mA, Single N.Channel, SOT.883 (XDFN3) 1.0 x 0.6 x 0.4 mm Package

File Size 119.79K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-6418-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    SIEMENS AG
Part No. HYB3164400T-60 HYB3165400T-60 HYB3164400T-50 HYB3165400J-60
Description 16M x 4-Bit Dynamic RAM
High-Speed Fully-Differential Amplifiers 8-MSOP-PowerPAD 0 to 70
Circular Connector; Body Material:Aluminum Alloy; Series:MS3116; Number of Contacts:11; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Pin 16M X 4 FAST PAGE DRAM, 60 ns, PDSO34

File Size 451.62K  /  28 Page

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Amphenol Communications Solutions

Part No. 69133-164HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    V53C316405A50 V53C316405A V53C316405A60

Mosel Vitelic Corp
Mosel Vitelic, Corp
Mosel Vitelic Corp
Part No. V53C316405A50 V53C316405A V53C316405A60
Description 3.3 VOLT 4M x 4 EDO PAGE MODE CMOS DYNAMIC RAM

File Size 169.34K  /  24 Page

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Amphenol Communications Solutions

Part No. 77316-448LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    SIEMENS AG
Part No. HYB3165805TL-60 HYB3164805T-50
Description 8M x 8-Bit Dynamic RAM 8M X 8 EDO DRAM, 60 ns, PDSO34
8M x 8-Bit Dynamic RAM 8M X 8 EDO DRAM, 50 ns, PDSO34

File Size 481.23K  /  32 Page

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Amphenol Communications Solutions

Part No. 131-6414-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    SIEMENS[Siemens Semiconductor Group]
Infineon
Part No. HYB3164400T-60 HYB3164400T-50 HYB3164400J-60 HYB3164400J-50 HYB3165400T-60 HYB3164400J HYB3165400J-50 HYB3165400J-60 HYB3165400T-50
Description 16M x 4-Bit Dynamic RAM (4k & 8k Refresh)

File Size 446.07K  /  28 Page

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Amphenol Communications Solutions

Part No. 61083-164500PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    SIEMENS[Siemens Semiconductor Group]
Infineon
Part No. HYB3164800T-60 HYB3164800T-50 HYB3164800J-60 HYB3164800J-50 HYB3165800J-60 HYB3165800J-50 HYB3165800T-60 HYB3164800J HYB3165800T-50
Description 8M x 8-Bit Dynamic RAM (4k & 8k Refresh)

File Size 451.76K  /  28 Page

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Amphenol Communications Solutions

Part No. 77316-444LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 7 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    1-794328-0 1-794328-1 316455-1 1-770901-0 1-794071-0 1-794432-0 1-794432-1 1-2110832-1 1-2110832-3 1-2110832-8 1-2110832

Tyco Electronics
Part No. 1-794328-0 1-794328-1 316455-1 1-770901-0 1-794071-0 1-794432-0 1-794432-1 1-2110832-1 1-2110832-3 1-2110832-8 1-2110832-2 1-2110832-5 1-2110832-7 1-2110832-0 1-794325-1 1-794327-0 1-794327-1 1-794330-1 1-794325-0 1-794329-1 1-794330-0 1-794326-0 1-794326-1 1-794329-0 794423-1 1-770872-1
Description Mini-Universal MATE-N-LOK Connector System
.163&quot; Centerline, 600 V, 9.5 A max.

File Size 474.84K  /  6 Page

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Amphenol Communications Solutions

Part No. 61083-164409LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    DAC3164IRGCR DAC3154 DAC3154IRGCR DAC3154IRGCT

Pan Jit International Inc.
Pan Jit International I...
Part No. DAC3164IRGCR DAC3154 DAC3154IRGCR DAC3154IRGCT
Description Dual 12-/10-Bit 500 MSPS Digital-to-Analog Converters

File Size 1,213.22K  /  46 Page

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Amphenol Communications Solutions

Part No. 131-6416-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

For 71439-3164 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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