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  70475-0076 Datasheet PDF File

For 70475-0076 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    14-45-0206 70475-0075 A-70475-0075

Molex Electronics Ltd.
Part No. 14-45-0206 70475-0075 A-70475-0075
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ) Tin (Sn), 6 Circuits

File Size 151.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 10076801-101-28LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 28 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    14-45-0218 70475-0087 A-70475-0087

Molex Electronics Ltd.
Part No. 14-45-0218 70475-0087 A-70475-0087
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ) Tin (Sn), 18 Circuits

File Size 150.79K  /  2 Page

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Amphenol Communications Solutions

Part No. 10076801-101-12LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    14-45-0217 A-70475-0086

Molex Electronics Ltd.
Part No. 14-45-0217 A-70475-0086
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ) Tin (Sn), 17 Circuits

File Size 143.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 10076801-406-10LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 10 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    14-45-0213 70475-0082 A-70475-0082

Molex Electronics Ltd.
Part No. 14-45-0213 70475-0082 A-70475-0082
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ) Tin (Sn), 13 Circuits

File Size 151.92K  /  3 Page

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Amphenol Communications Solutions

Part No. 10076801-101-40LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 40 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    14-45-0202 A-70475-0071

Molex Electronics Ltd.
Part No. 14-45-0202 A-70475-0071
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ) Tin (Sn), 2 Circuits

File Size 151.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 10076801-405T18LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 18 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    14-44-5209 A-70475-2178

Molex Electronics Ltd.
Part No. 14-44-5209 A-70475-2178
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 9 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 9 Circuits

File Size 148.60K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021121-00076T1LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 76Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    14-44-5208 70475-2177 A-70475-2177

Molex Electronics Ltd.
Part No. 14-44-5208 70475-2177 A-70475-2177
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 8 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 8 Circuits

File Size 149.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 10076801-101-14LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 14 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    14-44-5207 A-70475-2176

Molex Electronics Ltd.
Part No. 14-44-5207 A-70475-2176
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 7 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 7 Circuits

File Size 149.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 10076801-105-12LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    14-44-5204 70475-2173 A-70475-2173

Molex Electronics Ltd.
Part No. 14-44-5204 70475-2173 A-70475-2173
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 4 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 4 Circuits

File Size 149.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 10076801-404T06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 6 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    14-44-5203 70475-2172 A-70475-2172

Molex Electronics Ltd.
Part No. 14-44-5203 70475-2172 A-70475-2172
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 3 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 3.81μm (150μ) Tin (Sn), 3 Circuits

File Size 149.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 10076801-105-20LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 20 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

For 70475-0076 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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