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  64319-3218 Datasheet PDF File

For 64319-3218 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    Samsung Electronics
Part No. K7D321874A K7D323674A
Description 1Mx36 & 2Mx18 SRAM

File Size 223.03K  /  18 Page

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Amphenol Communications Solutions

Part No. 68683-218LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    K7I323682C K7I321882C

Samsung semiconductor
Part No. K7I323682C K7I321882C
Description 1Mx36 & 2Mx18 DDRII CIO b2 SRAM

File Size 413.81K  /  18 Page

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Amphenol Communications Solutions

Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    K7I321884C K7I323684C

Samsung semiconductor
Part No. K7I321884C K7I323684C
Description 1Mx36 & 2Mx18 DDRII CIO b4 SRAM

File Size 414.96K  /  18 Page

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Amphenol Communications Solutions

Part No. RJMG133218101DR
Description RJMG, Input output Connectors, 10/100 stack single USB 2.0, with led
Tech specs    

Official Product Page

    K7D321874C K7D323674C

Samsung semiconductor
Part No. K7D321874C K7D323674C
Description 1Mx36 & 2Mx18 SRAM

File Size 494.36K  /  18 Page

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Amphenol Communications Solutions

Part No. 88903-218LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 2 Mod
Tech specs    

Official Product Page

    K7K3236U2C K7K3218U2C

Samsung semiconductor
Part No. K7K3236U2C K7K3218U2C
Description 1Mx36 & 2Mx18 DDRII CIO b2 SRAM

File Size 439.18K  /  19 Page

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Amphenol Communications Solutions

Part No. 54122-411321800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    K7K3236T2C K7K3218T2C

Samsung semiconductor
Part No. K7K3236T2C K7K3218T2C
Description 1Mx36 & 2Mx18 DDRII CIO b2 SRAM

File Size 439.86K  /  19 Page

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Amphenol Communications Solutions

Part No. 54112-109321800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K7S3236T4C K7S3218T4C

Samsung semiconductor
Part No. K7S3236T4C K7S3218T4C
Description 1Mx36 & 2Mx18 QDRTM II b4 SRAM

File Size 441.06K  /  20 Page

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Amphenol Communications Solutions

Part No. 89073-218LF
Description 4 Row Signal Header, Straight, Press-Fit, 1 Mod, Selective Loading
Tech specs    

Official Product Page

    K7K3236T2C K7K3218T2C

Samsung semiconductor
Part No. K7K3236T2C K7K3218T2C
Description 1Mx36 & 2Mx18 DDRII CIO b2 SRAM

File Size 402.03K  /  19 Page

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Amphenol Communications Solutions

Part No. 131-3218-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    K7J323682C K7J321882C

Samsung semiconductor
Part No. K7J323682C K7J321882C
Description 1Mx36 & 2Mx18 DDR II SIO b2 SRAM

File Size 410.17K  /  18 Page

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Amphenol Communications Solutions

Part No. 51721-10003218ABLF
Description PwrBlade®, Power Supply Connectors, 32S 18P Right Angle Header.
Tech specs    

Official Product Page

   
Part No. 3SK254NE93218
Description 300mA LDO Linear Regulators with Internal Microprocessor Reset Circuit

File Size 97.04K  /  7 Page

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Amphenol Communications Solutions

Part No. 65823-218LF
Description Quickie Header, Wire to Board Connector, Double Row, 14 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header .
Tech specs    

Official Product Page

For 64319-3218 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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