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  5566-02B2 Datasheet PDF File

For 5566-02B2 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    PULSE ELECTRONICS CORP
Part No. E5562-20ED14-L E5566-20ED16-L E5562-20ED16-L
Description 12 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SOLDER, JACK
36 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SOLDER, JACK
File Size 37.58K  /  1 Page

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Amphenol Communications Solutions
Part No. 95278-402B26LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    BTS5566G SPOC-BTS5566G

Infineon Technologies AG
Part No. BTS5566G SPOC-BTS5566G
Description SPI Power Controller
48 A BUF OR INV BASED PRPHL DRVR, PDSO36 GREEN, PLASTIC, SOP-36
File Size 520.54K  /  42 Page

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Amphenol Communications Solutions
Part No. 95278-402B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    Vishay Intertechnology, Inc.
Part No. 2N5566 2N5565 2N5564 70254
Description Matched N-Channel JFET Pairs(最小栅源击穿电40V，栅极工作电3pA的N沟道结型场效应管) 匹配N沟道场效应对（最小栅源击穿电 40V的，栅极工作电流pA的N沟道结型场效应管
From old datasheet system
File Size 46.03K  /  5 Page

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Amphenol Communications Solutions
Part No. 95278-402B22LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    IFN5564 IFN5566 IFN5565

InterFET Corporation
Part No. IFN5564 IFN5566 IFN5565
Description N-Channel dual silicon junction field-effect transistor
File Size 94.16K  /  1 Page

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Amphenol Communications Solutions
Part No. 95278-802B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    CITIZEN ELECTRONICS CO....
Part No. CLL130-0102B2-273M1C5
Description    This data sheet is applied to the LED package
File Size 489.53K  /  14 Page

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Amphenol Communications Solutions
Part No. 95278-402B28LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    CITIZEN ELECTRONICS CO....
Part No. CLL130-0102B2-303M1C5
Description    This data sheet is applied to the LED package
File Size 488.94K  /  14 Page

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Amphenol Communications Solutions
Part No. 95278-802B26LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

   
Part No. 36702B220J
Description 1 ELEMENT, 22 uH, GENERAL PURPOSE INDUCTOR, SMD
File Size 249.48K  /  4 Page

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Amphenol Communications Solutions
Part No. 95278-802B24LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    PULSE ELECTRONICS CORP
Part No. E5566-20L511-L E5562-20L521-L
Description 6 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SOLDER, JACK
2 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SOLDER, JACK
File Size 56.12K  /  1 Page

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Amphenol Communications Solutions
Part No. 95278-102B26LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    A556606B2

Molex Electronics Ltd.
Part No. A556606B2
Description 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock
File Size 395.63K  /  4 Page

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Amphenol Communications Solutions
Part No. 95278-802B28LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    Microsemi
Part No. APL602B2G APL602LG
Description Linear
File Size 135.73K  /  4 Page

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Amphenol Communications Solutions
Part No. 95278-502B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

For 5566-02B2 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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