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  4922-27L Datasheet PDF File

For 4922-27L Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    W27L01 W27L01P-70 W27L01P-90 W27L01Q-70 W27L01Q-90 W27L01T-70 W27L01T-90

Winbond Electronics Corp
Winbond Electronics, Corp.
Part No. W27L01 W27L01P-70 W27L01P-90 W27L01Q-70 W27L01Q-90 W27L01T-70 W27L01T-90
Description From old datasheet system
128K X 8 ELECTRICALLY ERASABLE EPROM 128K X 8 EEPROM 12V, 90 ns, PDSO32
File Size 240.62K  /  15 Page

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Amphenol Communications Solutions
Part No. 68449-220HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    SGS Thomson Microelectronics
STMicro
Part No. TS27L4M TS27L4I TS27L4C
Description VERY LOWPOWER CMOS QUAD OPERATIONAL AMPLIFIERS
File Size 84.76K  /  9 Page

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Amphenol Communications Solutions
Part No. 72394-9221LF
Description Metral® Cable Connectors, Backplane Connectors, Connector sub assembly, 2 Row, Metral Unshielded Cable Connector Assembly.
Tech specs 　 　

Official Product Page

    HF9117-012L-0-I HF9117-012L-02-I HF9117-005L-0-I HF9117-005L-01-I HF9117-005L-03-I HF9117-005L-02-I HF9117-006L-1-I HF91

Hongfa Technology
Part No. HF9117-012L-0-I HF9117-012L-02-I HF9117-005L-0-I HF9117-005L-01-I HF9117-005L-03-I HF9117-005L-02-I HF9117-006L-1-I HF9117-018M-01-I HF9117-018M-1-I HF9117-018M-2-I HF9117-012M-02-I HF9117-012M-0-I HF9117-027L-0-I HF9117-027L-01-I HF9117-027L-03-I HF9117-027L-1-I HF9117-027L-02-I
Description HERMETICALLY SEALED ELECTRO MAGNETIC RELAUY
File Size 38.27K  /  3 Page

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Amphenol Communications Solutions
Part No. 61083-124922PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Tech specs 　 　

Official Product Page

    HF9114-012L-01-I HF9114-005L-02-I HF9114-005L-01-I HF9114-005L-03-I HF9114-018M-02-I HF9114-018M-01-I HF9114-006L-01-I H

Hongfa Technology
Part No. HF9114-012L-01-I HF9114-005L-02-I HF9114-005L-01-I HF9114-005L-03-I HF9114-018M-02-I HF9114-018M-01-I HF9114-006L-01-I HF9114-012M-03-I HF9114-012M-02-I HF9114-027L-02-I HF9114-027L-03-I HF9114-027L-01-I
Description HERMETICALLY SEALED RELAUY
File Size 38.01K  /  3 Page

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Amphenol Communications Solutions
Part No. 77313-492-24LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
Tech specs 　 　

Official Product Page

    HF9210-012L-01-I HF9210-005L-01-I HF9210-005L-04-I HF9210-018M-01-I HF9210-018M-04-I HF9210-006L-01-I HF9210-012M-01-I H

Hongfa Technology
Part No. HF9210-012L-01-I HF9210-005L-01-I HF9210-005L-04-I HF9210-018M-01-I HF9210-018M-04-I HF9210-006L-01-I HF9210-012M-01-I HF9210-027L-01-I HF9210-027L-04-I
Description HERMETICALLY SEALED RELAUY
File Size 48.22K  /  3 Page

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Amphenol Communications Solutions
Part No. 10134989-124922PLF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Receptacle, Dual Row, 120 Positions, 0.80mm (0.031in) Pitch.
Tech specs 　 　

Official Product Page

    W27L010 W27L010-12 W27L010-90 W27L010P-12 W27L010P-90 W27L010S-12 W27L010S-90

Winbond Electronics, Corp.
Winbond Electronics Corp
WINBOND[Winbond]
Part No. W27L010 W27L010-12 W27L010-90 W27L010P-12 W27L010P-90 W27L010S-12 W27L010S-90
Description 128K 8 ELECTRICALLY ERASABLE EPROM 128K X 8 EEPROM 12V, 90 ns, PDSO32
128K ′ 8 ELECTRICALLY ERASABLE EPROM
128K 8 ELECTRICALLY ERASABLE EPROM
128K ? 8 ELECTRICALLY ERASABLE EPROM
File Size 118.61K  /  14 Page

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Amphenol Communications Solutions
Part No. 61082-124922PLF
Description Bergstak® 0.80mm Pitch, Mezzanine Connectors, 120 Position, Receptacle, Dual Row.
Tech specs 　 　

Official Product Page

    W27L520S-90 W27L520W-90 W27L520 W27L520S-70 W27L520W-70

Winbond Electronics Corp
WINBOND[Winbond]
Part No. W27L520S-90 W27L520W-90 W27L520 W27L520S-70 W27L520W-70
Description 64K X 8 ELECTRICALLY ERASABLE EPROM
File Size 102.11K  /  16 Page

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Amphenol Communications Solutions
Part No. 10132449-2221GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 22 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

   
Part No. APIDELEVAN-MIL4922-45L
Description
File Size 1,172.12K  /  1 Page

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Amphenol Communications Solutions
Part No. 68492-272HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    HMC527LC4

Hittite Microwave Corporation
Part No. HMC527LC4
Description GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size 272.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 10134990-124922PLF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 120 Positions, 0.80mm (0.031in) Pitch.
Tech specs 　 　

Official Product Page

    HOLTEK[Holtek Semiconductor Inc]
Part No. HT27LC040
Description CMOS 512K 8-Bit OTP EPROM
File Size 167.04K  /  15 Page

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Amphenol Communications Solutions
Part No. 10132449-2211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 22 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

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