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  43650-0826 Datasheet PDF File

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    5033082610 503308-2610

Molex Electronics Ltd.
Part No. 5033082610 503308-2610
Description 0.40mm (.016) Pitch SlimStack Board-to-Board, Plug, SMT, Dual Row, Vertical Stacking
MOLEX Connector

File Size 375.63K  /  6 Page

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Amphenol Communications Solutions

Part No. 75160-826-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,4 position, 2.54mm pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87832-0826 0878320826

Molex Electronics Ltd.
Part No. 87832-0826 0878320826
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 8 Circuits, 0.38μm (15μ) Gold (Au) Plating, without PCB Locator
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 8 Circuits, 0.38μm (15μ) Gold (Au) Plating, without PCB Locator

File Size 198.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-108261800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0878980826 87898-0826

Molex Electronics Ltd.
Part No. 0878980826 87898-0826
Description 2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 8 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
MOLEX Connector

File Size 1,955.74K  /  22 Page

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Amphenol Communications Solutions

Part No. 61083-082602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs    

Official Product Page

    0528082670 52808-2670

Molex Electronics Ltd.
Part No. 0528082670 52808-2670
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 26Circuits, Lead-free
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 26Circuits, Lead-free

File Size 552.91K  /  10 Page

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Amphenol Communications Solutions

Part No. 54112-808260900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0923180826 92318-0826

Molex Electronics Ltd.
Part No. 0923180826 92318-0826
Description Picoflex庐 PF-50 IDT-Board In Z-Style, 8 Circuits
Picoflex? PF-50 IDT-Board In Z-Style, 8 Circuits

File Size 98.69K  /  2 Page

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Amphenol Communications Solutions

Part No. 61083-082606LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 43650-0330 43650-0417 43650-9915 43650-1116 43650-0917 43650-1115
Description MicroFit 3.0 SR Vert TH/Void Tin 3 Ckt 2 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
HEADER,4 POS,VERTICAL,.118 PIT. SELCT GOLD PLATING,15U MIN 4 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
MicroFit 3.0 SR Vert TH/Void Tin 5Ckt 4 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; No. of Contacts:11; Pitch Spacing:0.118"; No. of Rows:1; Series:Mini-Fit 3.0; Body Material:Liquid Crystal Polymer 11 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
MicroFit 3.0 SR Vert TH Peg 30Au 9Ckt 9 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CONN HEADER 11POS 3MM VERT TIN 11 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 249.45K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-082600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs    

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 43650-0301 43650-0700 43650-1200 43650-1102 43650-1202 43650-1001
Description CONN HEADER 3POS 3MM RT ANG GOLD 3 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
Header; No. of Contacts:7; Pitch Spacing:0.118"; No. of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer RoHS Compliant: Yes 7 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
CONN HEADER 12POS 3MM RT ANG TIN 12 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
MicroFit 3.0 SR RA TH Peg 30Au 11Ckt 11 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
MicroFit 3.0 SR RA TH Peg 30Au 12Ckt 12 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
Header; No. of Contacts:10; Pitch Spacing:0.118"; No. of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer RoHS Compliant: Yes

File Size 121.86K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-082600LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs    

Official Product Page

    CS4365-CQZR CS4365-DQZ CS4365-DQZR CS436507

Cirrus Logic
Part No. CS4365-CQZR CS4365-DQZ CS4365-DQZR CS436507
Description 114 dB, 192 kHz 6-Channel D/A Converter

File Size 612.30K  /  52 Page

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Amphenol Communications Solutions

Part No. 61082-082602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.
Tech specs    

Official Product Page

    Bel Fuse, Inc.
BEL[Bel Fuse Inc.]
Part No. 0826-1X1T-80-F BELFUSEINC-0826-1X1T-80-F
Description INTEGRATED CONNECTOR MODULES DATACOM TRANSFORMER FOR ETHERNET APPLICATION(S)

File Size 188.42K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-108261600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MC13077 MC13077DW MC13077P MC13077_D ON0826

Motorola, Inc
ON Semi
Part No. MC13077 MC13077DW MC13077P MC13077_D ON0826
Description ADVANCED PAL/NTSC ENCODER
From old datasheet system

File Size 245.87K  /  14 Page

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Amphenol Communications Solutions

Part No. 54101-G0826LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

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