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  1641-394H Datasheet PDF File

For 1641-394H Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

   
Part No. CAT1641 CAT3604-A CAT3614 CAT3616 CAT3626
Description Catalyst Semiconductor

File Size 842.08K  /  28 Page

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Amphenol Communications Solutions

Part No. 87916-411HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    LT1640AH LT1640AL LT1641-1 LT1641-2 LTC4251B-2 LTC4251B-1

Linear Technology
Part No. LT1640AH LT1640AL LT1641-1 LT1641-2 LTC4251B-2 LTC4251B-1
Description Negative Voltage Hot Swap Controllers
?8V Hot Swap Controllers

File Size 456.78K  /  36 Page

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Amphenol Communications Solutions

Part No. 68016-411HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 11 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    MB90F394HAPMT MB90394HAPMT MB90390

Fujitsu Media Devices Limited
Part No. MB90F394HAPMT MB90394HAPMT MB90390
Description 16-bit Proprietary Microcontroller

File Size 425.89K  /  71 Page

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Amphenol Communications Solutions

Part No. 61641-303LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 57102</b></span><br><br>Minitek® 2.00mm, Board/Wire to Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, Duplex, Polarized, 26 Position ,2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    MONOLITHIC MEMORIES
Part No. 53D1641W883B
Description 4K X 4 OTPROM, 30 ns, CDFP24

File Size 233.14K  /  8 Page

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Amphenol Communications Solutions

Part No. 68016-415HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    Vishay Intertechnology, Inc.
Part No. HY5116410LRC-80
Description x4 Fast Page Mode DRAM x4快速页面模式的DRAM

File Size 522.83K  /  18 Page

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Amphenol Communications Solutions

Part No. 87916-415HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    LT1641-2IS8PBF LT1641-2IS8TR LT1641-1IS8TR LT1641-1IS8PBF LT1641-1IS8TRPBF

Linear Technology
Part No. LT1641-2IS8PBF LT1641-2IS8TR LT1641-1IS8TR LT1641-1IS8PBF LT1641-1IS8TRPBF
Description Positive High Voltage Hot Swap Controllers

File Size 153.75K  /  12 Page

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Amphenol Communications Solutions

Part No. 10136164-101LF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 12 column, 240 position, Right Angle Header, No Guide Pin.
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. THLY641641FG-80 THLY641641FG-80L THLY641641FG-10L
Description 16M Word x 64 Bit Synchronous DRAM Module(16Mx 64位同步动态RAM模块)

File Size 783.11K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-6414-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    LT1640AL LTC1642 LT4250 LTC4220 LT1641-1 LT1641-2

Linear Technology
Part No. LT1640AL LTC1642 LT4250 LTC4220 LT1641-1 LT1641-2
Description Negative Voltage Hot Swap Controllers

File Size 330.68K  /  36 Page

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Amphenol Communications Solutions

Part No. 131-6418-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    ER1641-434J ER1641-473K ER1641-181K ER1537-48J ER1840-36J ER1641-564J ER1025-10K ER1025-14J ER1025-03J ER1641-394K ER102

API DELEVAN
Part No. ER1641-434J ER1641-473K ER1641-181K ER1537-48J ER1840-36J ER1641-564J ER1025-10K ER1025-14J ER1025-03J ER1641-394K ER1025-24K ER1025-05J ER1641-274K ER1641-105J
Description 1 ELEMENT, 430 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 47 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 0.18 uH, PHENOLIC-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 27 uH, IRON-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 22 uH, IRON-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 560 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 0.39 uH, PHENOLIC-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 0.56 uH, PHENOLIC-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 0.2 uH, PHENOLIC-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 390 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 1.5 uH, IRON-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 0.24 uH, PHENOLIC-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 270 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR
1 ELEMENT, 1000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR

File Size 499.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 10136830-1641301LF
Description DDR4 DIMM, Storage and Server Connector, Vertical, Surface Mount, 288 Position, 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

    LAPIS SEMICONDUCTOR CO LTD
Part No. MR27V1641L-XXXMPZ03B
Description 16M X 1 MASK PROM, PDSO16

File Size 969.31K  /  17 Page

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Amphenol Communications Solutions

Part No. 131-6414-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

For 1641-394H Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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