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1N5249B MAX2106 SE5532AF MB3776 M48T58SH DE5PC3 FSDM0765 WP793ID
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  0154.630 Datasheet PDF File

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    0015477570

Molex Electronics Ltd.
Part No. 0015477570
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, Tin (Sn) Plating

File Size 377.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-415HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015477572

Molex Electronics Ltd.
Part No. 0015477572
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, Tin (Sn) Plating

File Size 377.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-410HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477660

Molex Electronics Ltd.
Part No. 0015477660
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-406HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477618

Molex Electronics Ltd.
Part No. 0015477618
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-154HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477616

Molex Electronics Ltd.
Part No. 0015477616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-407HALF
Description BS SR RA HDR TR 1X7
Tech specs    

Official Product Page

    0015477614

Molex Electronics Ltd.
Part No. 0015477614
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 59202-G38-20-154LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs    

Official Product Page

    0015477612

Molex Electronics Ltd.
Part No. 0015477612
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 377.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-401HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477606

Molex Electronics Ltd.
Part No. 0015477606
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-416HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477658

Molex Electronics Ltd.
Part No. 0015477658
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-421HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 21 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477656

Molex Electronics Ltd.
Part No. 0015477656
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 56 Circuits

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-424HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 24 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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