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molybdenum Datasheet PDF File

For molybdenum Found Datasheets File :: 578 Search Time::2.468ms
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				Hittite Microwave Corporation
Part No.	HMC578
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize ribbon bond length. Typi...
Description	GAAS MMIC X2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHZ OUTPUT
File Size	242.95K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC570
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typica...
Description	GaAs MMIC I/Q DOWNCONVERTER 17 - 21 GHz
File Size	305.56K / 8 Page	View it Online	Download Datasheet

				FAIRCHILD[Fairchild Semiconductor] Fairchild Semiconductor Corporation
Part No.	RMPA29000
OCR Text	...mal conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment should utilize Gold/Ti...
Description	27 - 30 GHZ 1 Watt Power Amplifier MMIC 27-30 GHZ 1 Watt Power Amplifier MMIC
File Size	285.59K / 10 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC451
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typica...
Description	GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5.0 - 20.0 GHz
File Size	343.24K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC516
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical d...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 17 GHz
File Size	289.37K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC517
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical d...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 17 - 26 GHz
File Size	286.67K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC518
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical d...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	291.06K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC519
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical d...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 18 - 32 GHz
File Size	306.71K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC520
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typica...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	282.91K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC521
OCR Text	... die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typica...
Description	GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size	280.40K / 6 Page	View it Online	Download Datasheet

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