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  90136-2206 Datasheet PDF File

For 90136-2206 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

   
Part No. 2SK2206
Description Low-Power, Single-/Dual-Level Battery Monitors with Hysteresis and Integrated µP Reset

File Size 20.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SPEAR-09-H02206

STMicroelectronics
Part No. SPEAR-09-H02206
Description SPEAr Head200 ARM 926, 200K customizable eASIC gates, large IP portfolio SoC

File Size 801.70K  /  71 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    意法半导
Part No. SPEAR-09-H02206
Description SPEAr Head200 ARM 926, 200K customizable eASIC gates, large IP portfolio SoC

File Size 809.06K  /  71 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ONSEMI[ON Semiconductor]
Part No. BUV22_06 BUV22 BUV22G BUV2206
Description SWITCHMODE Series NPN Silicon Power Transistor(开关模式系列硅NPN功率晶体

File Size 66.91K  /  4 Page

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Amphenol Communications Solutions

Part No. 71922-060LF
Description Quickie®, Wire to Board connectors, Double Row, 60Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header.
Tech specs    

Official Product Page

    182206-2 280708-1 280708-2

Tyco Electronics
Part No. 182206-2 280708-1 280708-2
Description AMPMODU II REC, CONTACT, HIGH PRESSURE, C.O.S.I.

File Size 89.23K  /  1 Page

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Amphenol Communications Solutions

Part No. 88952-206LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
Tech specs    

Official Product Page

    0901361318 90136-1318

Molex Electronics Ltd.
Part No. 0901361318 90136-1318
Description 2.54mm (.100) Pitch C-Grid III?Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 51952-206LF
Description PwrBlade®, Power Supply Connectors, 4P 20S Vertical Header.
Tech specs    

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    90136-1118 0901361118

Molex Electronics Ltd.
Part No. 90136-1118 0901361118
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-422-06LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    90136-1130 0901361130

Molex Electronics Ltd.
Part No. 90136-1130 0901361130
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-322-06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 06 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1132 0901361132

Molex Electronics Ltd.
Part No. 90136-1132 0901361132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 72206-100CAHLF
Description Card Bus Ass'y, Above Mount, S/D(68Pins), R/A, Type 123, 3.3V, 0mm s/o, Left Push Rod Eject, 9.5mm Eject Travel
Tech specs    

Official Product Page

    0901362209 90136-2209

Molex Electronics Ltd.
Part No. 0901362209 90136-2209
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 254.60K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131932-206ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Double row, 6 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

For 90136-2206 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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