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Molex Electronics Ltd.
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| Part No. |
0901361108 90136-1108
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.33K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1125 0901361125
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-103-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361106 90136-1106
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-102-56LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 56 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361105 90136-1105
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.33K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10106268-0013101LF
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| Description |
PwrBlade+® , Power Connectors, 52S STB, Vertical, Receptacle.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361104 90136-1104
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-103-06LF
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| Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Double Row, 6 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361103 90136-1103
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-102-24LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361102 90136-1102
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-101-72LF
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| Description |
BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-102-42LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 42 Positions
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| Tech specs |
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Official Product Page
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