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  90130-1112 Datasheet PDF File

For 90130-1112 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    2673901301

Fair-Rite Products Corp.
Part No. 2673901301
Description 73 SHIELD BEAD

File Size 514.80K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901301128 90130-1128

Molex Electronics Ltd.
Part No. 0901301128 90130-1128
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901301126 90130-1126

Molex Electronics Ltd.
Part No. 0901301126 90130-1126
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)

File Size 586.04K  /  7 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901301124 90130-1124

Molex Electronics Ltd.
Part No. 0901301124 90130-1124
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
MOLEX Connector

File Size 586.06K  /  7 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901301120 90130-1120

Molex Electronics Ltd.
Part No. 0901301120 90130-1120
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
Molex Electronics Ltd.

File Size 586.04K  /  7 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0190130032

Molex Electronics Ltd.
Part No. 0190130032
Description InsulKrimp Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250) by0.81mm (.032), 14-16 AWG, Blue Insulator, Tape and Reel
MOLEX Connector

File Size 97.63K  /  2 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0190130031

Molex Electronics Ltd.
Part No. 0190130031
Description InsulKrimp Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250) by0.81mm (.032), 14-16 AWG, Expanded Blue Insulator, Loose
MOLEX Connector

File Size 97.25K  /  2 Page

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Amphenol Communications Solutions

Part No. 10136647-031112LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 3 Positions, GW Compatible, without Posts, Tray packing.
Tech specs    

Official Product Page

    0190130029 190130029

Molex Electronics Ltd.
Part No. 0190130029 190130029
Description InsulKrimp Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250) by0.81mm (.032), 14-16 AWG, Blue Insulator, Tape
InsulKrimp垄芒 Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250") by0.81mm (.032"), 14-16 AWG, Blue Insulator, Tape
MOLEX Connector

File Size 107.35K  /  2 Page

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Amphenol Communications Solutions

Part No. G832MC111202122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    0901303330 90130-3330

Molex Electronics Ltd.
Part No. 0901303330 90130-3330
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 30 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-111202300LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 20 Positions
Tech specs    

Official Product Page

    0901301110 90130-1110

Molex Electronics Ltd.
Part No. 0901301110 90130-1110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. G832MC111204322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 6.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\ Gold Black.
Tech specs    

Official Product Page

For 90130-1112 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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