87914-2816 pdf Datasheet P11 Part Num --- IC-ON-LINE


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87914-2816 Datasheet PDF File

For 87914-2816 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

					Samsung Electronic
Part No.	K4H281638D
Description	128Mb DDR SDRAM Data Sheet
File Size	317.02K / 51 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-879-14LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0511281601 51128-1601
Description	2.50mm (.098") / 3.00mm (.118") Pitch Wire-to-Board Receptacle Housing with Fuse16 Circuits 2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse16 Circuits
File Size	89.45K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-816523000LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87760-2816 0877602816
Description	2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
File Size	160.34K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-128161250LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4M28163PH
Description	2M x 16Bit x 4 Banks Mobile SDRAM
File Size	140.49K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-428-16LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Renesas Electronics Corporation
Part No.	UPA2816T1S
Description	P-channel MOSFET ?0 V, ?7 A, 15.5 mΩ
File Size	137.11K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68682-816
Description	Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0877582816
Description	MOLEX Connector
File Size	170.91K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59202-S28-16-050LF
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs				Official Product Page

					Samsung
Part No.	K4S281632K
Description	128Mb K-die SDRAM
File Size	251.68K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-816202500LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd. http://
Part No.	44428-1604 SD-44428-001 0444281604
Description	3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without
File Size	232.66K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-816202500LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	52610-2816 52610-2916 52610-0516 52610-0571 52610-0616 52610-0716 52610-0771 52610-0916 52610-0671 52610-0816 52610-0871
Description	1.0 FPC CONN SMT ZIF EMBSTP PKG
File Size	481.08K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-816062600LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Stacking vertical header, Surface Mount, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	KFG2816Q1M-DEB
Description	(KFG2816Q1M-DEB / KFG2816U1M-DIB) Flash Memory
File Size	1,280.65K / 88 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-816122500LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

For 87914-2816 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

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