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  87758-1850 Datasheet PDF File

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    0877581216 87758-1216

Molex Electronics Ltd.
Part No. 0877581216 87758-1216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-409481850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877581050 87758-1050

Molex Electronics Ltd.
Part No. 0877581050 87758-1050
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.93K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580417 87758-0417

Molex Electronics Ltd.
Part No. 0877580417 87758-0417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-809241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877581017 87758-1017

Molex Electronics Ltd.
Part No. 0877581017 87758-1017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 10 Circuits
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5045LF
Description SFP+ Cable Assembly, 24 AWG, 4.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    0877581016

Molex Electronics Ltd.
Part No. 0877581016
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5095LF
Description SFP+ Cable Assembly, 24 AWG, 9.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    0877580616 87758-0616

Molex Electronics Ltd.
Part No. 0877580616 87758-0616
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5050HFLF
Description SFP+ Cable Assembly, 24 AWG, 5.0 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    0877580217 87758-0217

Molex Electronics Ltd.
Part No. 0877580217 87758-0217
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 2 Circuits, 0.76um (30u) Gold (Au) Selective Plating

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-110161850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580216 87758-0216

Molex Electronics Ltd.
Part No. 0877580216 87758-0216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 2 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-185-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs    

Official Product Page

    0877580416 87758-0416

Molex Electronics Ltd.
Part No. 0877580416 87758-0416
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109481850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580450 87758-0450

Molex Electronics Ltd.
Part No. 0877580450 87758-0450
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.92K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5015LF
Description SFP+ Cable Assembly, 24 AWG, 1.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

For 87758-1850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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