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  87758-1417 Datasheet PDF File

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    Microsemi
Part No. TCC1417-25 RF1037
Description From old datasheet system

File Size 676.66K  /  6 Page

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Amphenol Communications Solutions

Part No. 76341-417LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 17 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    RN1414 RN1417 RN1415 RN1416 RN1418

TOSHIBA[Toshiba Semiconductor]
Part No. RN1414 RN1417 RN1415 RN1416 RN1418
Description TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process)

File Size 268.29K  /  8 Page

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Amphenol Communications Solutions

Part No. 68771-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
Tech specs    

Official Product Page

    0877583250 87758-3250

Molex Electronics Ltd.
Part No. 0877583250 87758-3250
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-108141700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87758-5017 0877585017

Molex Electronics Ltd.
Part No. 87758-5017 0877585017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 77314-178LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    87758-3217 0877583217

Molex Electronics Ltd.
Part No. 87758-3217 0877583217
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 94611-417HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580014 87758-0014

Molex Electronics Ltd.
Part No. 0877580014 87758-0014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 183.80K  /  4 Page

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Amphenol Communications Solutions

Part No. 10141731-005RLF
Description DDR4 SODIMM 260pin SMT, 5.2H, reverse version., Right Angle
Tech specs    

Official Product Page

    0877584617 87758-4617

Molex Electronics Ltd.
Part No. 0877584617 87758-4617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 68461-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
Tech specs    

Official Product Page

    87758-4017 0877584017

Molex Electronics Ltd.
Part No. 87758-4017 0877584017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 77314-178TLF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    0877580216 87758-0216

Molex Electronics Ltd.
Part No. 0877580216 87758-0216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 2 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 10141744-001LF
Description HPCE VT Receptacle 2LP20S
Tech specs    

Official Product Page

    0877584417

Molex Electronics Ltd.
Part No. 0877584417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 44 Circuits, 0.76um (30u) Gold (Au) Selective Plating

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 10141730-001RLF
Description DDR4 SODIMM 260pin SMT, 5.2H, Standard version, Right Angle
Tech specs    

Official Product Page

For 87758-1417 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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