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Molex Electronics Ltd.
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| Part No. |
87758-3217 0877583217
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54202-S0816LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-108081600LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5017 0877585017
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.76K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10128638-160816CLF
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| Description |
HPCE R/A Receptacle 40P
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10121510-320816ALF
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| Description |
HPCE R/A Receptacle 40P16S
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10121510-320816ELF
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| Description |
HPCE R/A Receptacle 40P16S
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877581216 87758-1216
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54242-110081600LF
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| Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 8 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-081622LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-808161500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-S08-16
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
57102-G08-16
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 32 Positions - 2mm (0.079inch) - Vertical
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| Tech specs |
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Official Product Page
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Price and Availability
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