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  75730-0114 Datasheet PDF File

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    SICK AG
Part No. 6020114
Description INDUCTIVE PROXIMITY SENSORS

File Size 1,070.99K  /  6 Page

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Amphenol Communications Solutions

Part No. 71757-300CALF
Description Card Bus Ass'y, Above Mount, D/D(136Pins), R/A, Type 123, 3.3V, 0mm s/o, Left Push Rod Eject, 9.5mm Eject Travel
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    S6D0114

Samsung Electronic
Samsung semiconductor
Part No. S6D0114
Description 132-RGB X 176-DOT 1-CHIP DRIVER IC FOR 262,144-COLOR TFT-LCD DISPLAY
132 RGB X 176 DOT 1-CHIP DRIVER IC WITH INTERNAL GRAM FOR 262,144 Colors TFT-LCD

File Size 1,899.08K  /  143 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    TV0114B

TAI-SAW TECHNOLOGY CO., LTD.
Part No. TV0114B
Description SMD 8.2x6.0 Baby Monitor VCO

File Size 160.35K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    XF0114-CMCSM

XFMRS Inc.
Part No. XF0114-CMCSM
Description CMC

File Size 53.18K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    1140-4007 0011-40-4007 8301-1 001140-4007

Molex Electronics Ltd.
Part No. 1140-4007 0011-40-4007 8301-1 001140-4007
Description Insulation Punch

File Size 14.63K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

Official Product Page

    3M ELECTRONIC PRODUCTS DIVISION
Part No. 10114-6000EC
Description TELECOM AND DATACOM CONNECTOR, PLUG

File Size 139.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    8342-1 0011-40-4844 001140-4844

Molex Electronics Ltd.
Part No. 8342-1 0011-40-4844 001140-4844
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    8341-3 1140-4377 11-40-4377 001140-4377 0011-40-4377

Molex Electronics Ltd.
Part No. 8341-3 1140-4377 11-40-4377 001140-4377 0011-40-4377
Description Insulation Anvil

File Size 16.17K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

Official Product Page

    4400.0179 4400.0178 4400.0120 4400.0114 T11-811

Schurter Inc.
Part No. 4400.0179 4400.0178 4400.0120 4400.0114 T11-811
Description Circuit Breaker for Equipment thermal, Drop-in type, Reset type, Quick connect terminals

File Size 335.46K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

Official Product Page

    39-00-0114 5556PBS

Molex Electronics Ltd.
http://
Part No. 39-00-0114 5556PBS
Description 4.20mm (.165) Pitch Mini-Fit Crimp Terminal, Female, Tin Plating, 18- 24 AWG, Reel

File Size 219.96K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

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