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  71308-6440 Datasheet PDF File

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    Hitachi
Part No. HD64404BT
Description RISC Engine Peripheral LSI

File Size 4,981.73K  /  1210 Page

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Amphenol Communications Solutions

Part No. 10136644-0322LF
Description Minitek® Pwr 4.2 , Single Row, Receptacle Housing, 3 Positions, Non GW Compatible Nylon66, Black Color.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    713084222 015-91-1223

Molex Electronics Ltd.
Part No. 713084222 015-91-1223
Description 2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 22 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Peg
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.63K  /  8 Page

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Amphenol Communications Solutions

Part No. 10136644-0311LF
Description Minitek® Pwr 4.2 , Single Row, Receptacle Housing, 3 Positions, GW Compatible Nylon66, Natural Color.
Tech specs    

Official Product Page

    FST6435 FST6440 FST6445

Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
Part No. FST6435 FST6440 FST6445
Description MOSFET, DUAL PP SO-8 30 A, 40 V, SILICON, RECTIFIER DIODE
Schottky MiniMod

File Size 140.17K  /  2 Page

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Amphenol Communications Solutions

Part No. 68764-403HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. 5962-8764401SX
Description 8-Bit D-Type Latch

File Size 375.93K  /  12 Page

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Amphenol Communications Solutions

Part No. 87606-440LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 80 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0713086446 71308-6446

Molex Electronics Ltd.
Part No. 0713086446 71308-6446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 61083-064409LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 60 Positions.
Tech specs    

Official Product Page

    0713086478

Molex Electronics Ltd.
Part No. 0713086478
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50μm (59u) Minimum
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50楼矛m (59u") Minimum

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 68764-406HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71308-5446 0713085446

Molex Electronics Ltd.
Part No. 71308-5446 0713085446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 68764-404HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71308-5448 0713085448

Molex Electronics Ltd.
Part No. 71308-5448 0713085448
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 48 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB LocatorPegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 61083-164402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    71308-5450 0713085450

Molex Electronics Ltd.
Part No. 71308-5450 0713085450
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10069525-164402LF
Description Bergstak® 0.80mm Pitch, Board to Board, Vertical, Plug Assembly, 160 Positions, Dual Row.
Tech specs    

Official Product Page

    0713086476

Molex Electronics Ltd.
Part No. 0713086476
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 68464-408HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 71308-6440 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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