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  151-4412 Datasheet PDF File

For 151-4412 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    14-44-1221 0014441221

Molex Electronics Ltd.
Part No. 14-44-1221 0014441221
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.38μm (15μ) Gold (Au), 21 Circuits

File Size 112.62K  /  3 Page

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Amphenol Communications Solutions

Part No. 75844-129-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    14-44-1222 0014441222

Molex Electronics Ltd.
Part No. 14-44-1222 0014441222
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.38μm (15μ) Gold (Au), 22 Circuits

File Size 112.62K  /  3 Page

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Amphenol Communications Solutions

Part No. 75844-127-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73944-1200 0739441200

Molex Electronics Ltd.
Part No. 73944-1200 0739441200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-120R10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73944-1201 0739441201

Molex Electronics Ltd.
Part No. 73944-1201 0739441201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-124-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51441-2472 0514412472

Molex Electronics Ltd.
Part No. 51441-2472 0514412472
Description 0.50mm (.020) Pitch Easy-On?/a> Type FFC/FPC Connector, Right Angle, SMT, ZIF,Bottom Contact Style, 1.10mm (.043) Mated Height, 24 Circuits, Lead-free, GoldContact Plating
0.50mm (.020) Pitch Easy-On Type FFC/FPC Connector, Right Angle, SMT, ZIF,Bottom Contact Style, 1.10mm (.043) Mated Height, 24 Circuits, Lead-free, GoldContact Plating

File Size 492.48K  /  7 Page

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Amphenol Communications Solutions

Part No. 75844-127-26LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-44-1220 0014441220

Molex Electronics Ltd.
Part No. 14-44-1220 0014441220
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.38μm (15μ) Gold (Au), 20 Circuits

File Size 112.62K  /  3 Page

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Amphenol Communications Solutions

Part No. 10056844-126ALF
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Header, Vertical, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0739441217

Molex Electronics Ltd.
Part No. 0739441217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 10124412-12JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 2-Pair, 8 column, 64 position, Vertical Header, Left Guide Pin.
Tech specs    

Official Product Page

    14-44-1225 0014441225

Molex Electronics Ltd.
Part No. 14-44-1225 0014441225
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.38μm (15μ) Gold (Au), 25 Circuits

File Size 112.63K  /  3 Page

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Amphenol Communications Solutions

Part No. 75844-120R20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0739441216

Molex Electronics Ltd.
Part No. 0739441216
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-120R08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-44-1202 0014441202

Molex Electronics Ltd.
Part No. 14-44-1202 0014441202
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 0.38μm (15μ) Gold (Au), 2 Circuits

File Size 112.62K  /  3 Page

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Amphenol Communications Solutions

Part No. 93944-122HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 151-4412 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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