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  001547-9079 Datasheet PDF File

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    0015477620

Molex Electronics Ltd.
Part No. 0015477620
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.31K  /  4 Page

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Amphenol Communications Solutions

Part No. 51939-079LF
Description PwrBlade®, Power Connectors, 2P 24S 2P Right Angle Header, Solder To Board
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015477658

Molex Electronics Ltd.
Part No. 0015477658
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 66429-079LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    0015477606

Molex Electronics Ltd.
Part No. 0015477606
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68449-079
Description 68449-079-B/S II
Tech specs    

Official Product Page

    0015477612

Molex Electronics Ltd.
Part No. 0015477612
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 377.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 68449-079HLF
Description 68449-079HLF-B/S II DR
Tech specs    

Official Product Page

    0015477614

Molex Electronics Ltd.
Part No. 0015477614
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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    0015477616

Molex Electronics Ltd.
Part No. 0015477616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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    0015477618

Molex Electronics Ltd.
Part No. 0015477618
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.39K  /  4 Page

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    0015477660

Molex Electronics Ltd.
Part No. 0015477660
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective

File Size 377.32K  /  4 Page

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    0015477572

Molex Electronics Ltd.
Part No. 0015477572
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, Tin (Sn) Plating

File Size 377.35K  /  4 Page

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    0015477570

Molex Electronics Ltd.
Part No. 0015477570
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, Tin (Sn) Plating

File Size 377.35K  /  4 Page

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