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LBN09603 P10A9 1N5194 E003996 AD7242 C1000 25T06HB BA7613N
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  TDL3-1211 Datasheet PDF File

For TDL3-1211 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    RF Monolithics
Part No. RF1211D
Description SAW Filter

File Size 95.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136353-12111LF
Description Minitek® 1.5mm Wire to Board Receptacle Right Angle Surface Mount Type, Tin plating, 12 positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    RF Monolithics, Inc.
Part No. RF1211B
Description 315.0 MHz SAW Filter

File Size 68.88K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-110102000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Inchange Semiconductor ...
Part No. 2SK1211
Description Drain Current ?ID=2.5A@ TC=25C

File Size 63.84K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-110062000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TS61211

Bothhand USA, LP.
Part No. TS61211
Description 10/100 BASE-T ISOLATION TRANSFORMER

File Size 248.70K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-112400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SYNC POWER
Part No. SPE1211
Description Single-Line ESD Protection Array

File Size 184.06K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-110402100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    XN01211

Panasonic Semiconductor
Part No. XN01211
Description Silicon NPN epitaxial planer transistor

File Size 36.13K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021211-00006T8LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
Toshiba, Corp.
Part No. TA1211 TA1211N
Description Bi-SCANABLE RGB PROCESSOR SCANABLE的RGB处理

File Size 2,145.22K  /  50 Page

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Amphenol Communications Solutions

Part No. 54112-110101700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. D1211UK
Description Gold Metallised Multi-Purpose Silicon DMOS RF FET(10W-12.5V-500MHz,Single Ended)(镀金多用DMOS射频硅场效应10W-12.5V-500MHz,单端)

File Size 16.59K  /  2 Page

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Amphenol Communications Solutions

Part No. 10131319-12111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 12 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    Panasonic
Part No. XP01211
Description Composite Device - Composite Transistors

File Size 77.48K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137925-1211LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 12 Positions, GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

    Maxim
Part No. MAX1211
Description 40Msps / 12-Bit ADC

File Size 610.64K  /  29 Page

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Amphenol Communications Solutions

Part No. 20021211-00012T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 12 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

For TDL3-1211 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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