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TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
Toshiba, Corp.
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| Part No. |
RN1903 RN1906 RN1901 RN1902 RN1904 RN1905
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| Description |
Transistor Silicon NPN Epitaxial Type (PCT Process) Switching, Inverter Circuit, Interface Circuit And Driver Circuit Applications
TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process)
LED 5X5MM SQR RED DIFF PANEL MT 东芝npn型晶体管硅外延型（厘进程
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| File Size |
259.46K /
7 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10131319-02121G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Sanyo
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| Part No. |
2SB1266 2SD1902
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| Description |
NPN Triple Diffused Planar Type Silicon Transistors AF Power Amplifier Applications
PNP/NPN Triple Diffused Planar Type Silicon Transistors
PNP Triple Diffused Planar Type Silicon Transistors AF Power Amplifier Applications
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| File Size |
45.31K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69190-216HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-214HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-212HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 12 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127819-02521LF
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| Description |
Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Black Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131319-0212100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-202
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 02 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-203HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 03 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127819-02121LF
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| Description |
Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0740619021 74061-9021
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| Description |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, Lead Free, 80 Circuits, Pin Length 4.75mm (.187)
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, Lead Free, 80 Circuits, Pin Length 4.75mm
MOLEX Connector
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| File Size |
502.92K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10131319-02221G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 2 Positions, GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Price and Availability
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