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  M470L2923BN0-CB0 Datasheet PDF File

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9F4008W0A-TCB0 K9F4008W0A-TIB0
Description Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; No. of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight 12k × 8位NAND快闪记忆

File Size 321.40K  /  24 Page

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HUA FENG CIRCUIT





    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F1608W0A-TCB0 K9F1608W0A-TIB0
Description    2M x 8 Bit NAND Flash Memory
TV 37C 37#16 PIN RECP 200万8位NAND闪存
TV 128C 128#22D SKT RECP

File Size 446.53K  /  25 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9K1208U0M-YIB0 K9K1208U0M-YCB0
Description 64M x 8 Bit NAND Flash Memory 6400 × 8位NAND闪存

File Size 357.11K  /  26 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9K1G08U0M-YIB0 K9K1G08U0M-YCB0
Description 128M x 8 Bit NAND Flash Memory

File Size 477.43K  /  37 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9F3208W0A-TCB0 K9F3208W0A-TIB0
Description Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; Number of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; No. of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight 4米8位NAND闪存

File Size 561.61K  /  27 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9F6408U0B-TIB0 K9F6408U0B-TCB0
Description 8M x 8 Bit NAND Flash Memory 8米8位NAND闪存

File Size 418.95K  /  27 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F6408U0M-TCB0 K9F6408U0M-TIB0
Description 8M x 8 Bit NAND Flash Memory

File Size 483.65K  /  26 Page

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Part No. KFM1216Q2M-DCB00
Description 32M X 16 FLASH 1.8V PROM, 76 ns, PBGA48

File Size 925.35K  /  74 Page

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Part No. K9T1G08B0M-FCB00
Description 128M X 8 FLASH 2.7V PROM, 30 ns, PDSO48

File Size 895.04K  /  38 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9F2808U0M-YIB0 K9F2808U0M-YCB0
Description 16M x 8 Bit NAND Flash Memory 1,600 × 8位NAND闪存

File Size 349.99K  /  26 Page

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