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Amphenol Communications Solutions |
| Part No. |
95278-101B22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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STMicroelectronics
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| Part No. |
STD4NK60Z-1 STD4NK60ZT4 STP4NK60Z STP4NK60ZFP STB4NK60Z-1
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| Description |
N-channel 600 V, 1.76 Ω, 4 A SuperMESH Power MOSFET in DPAK, D2PAK, IPAK, I2PAK, TO-220, TO-220FP N-channel 600 V, 1.76 Ω, 4 A SuperMESH?Power MOSFET in DPAK, D2PAK, IPAK, I2PAK, TO-220, TO-220FP
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| File Size |
944.72K /
28 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
95278-801B22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
98464-G61B22ULF
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| Description |
Minitek® 2.00mm, Wire To Board, Shrouded Header, Right Angle, Through Hole, Double Row, 22 Positions
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Official Product Page
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Kemet Corporation
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| Part No. |
T591B227M006ATE070
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| Description |
T591, Tantalum, Polymer Tantalum, 220 uF, 20%, 6.3 VDC, SMD, Polymer, Molded, Low ESR, 70 mOhms, 3528, Height Max = 2.1mm
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| File Size |
69.87K /
1 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
95278-401B22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-501B22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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KOA SPEER ELECTRONICS INC
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| Part No. |
MHI0402CSTD2N2 MHI0402CSTD4N7 MHI0402CSTD1N0 MHI0402CSTD3N3
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| Description |
1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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| File Size |
74.67K /
2 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
133-311B-22H
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| Description |
Paladin Plus 3-Pair, 6 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, APP
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
133-411B-22D
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| Description |
Paladin Plus 4-Pair, 6 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, NiS
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
133-311B-22D
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| Description |
Paladin Plus 3-Pair, 6 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, NiS
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
133-411B-22H
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| Description |
Paladin Plus 4-Pair, 6 Column, Direct Orthogonal Header, Double End Wall, 2.25mm Wipe, APP
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| Tech specs |
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Official Product Page
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Murata Manufacturing Co., Ltd. MURATA MANUFACTURING CO LTD
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| Part No. |
BLM21B601SPT BLM21B601SPT1 BLM11B601SPT BLM10B421SDPT1 BLM10B601SDPT1 BLM11B222SDPT1
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| Description |
EMI FILTER FERRITE BEAD 600 OHM@100MHZ 200MA SMD 0805 1 FUNCTIONS, 0.2 A, FERRITE CHIP 1 FUNCTIONS, 0.2 A, FERRITE CHIP EIA STD PACKAGE SIZE 0805 FERRITE BEAD, 0603, 600 MHZ, 200MA 1 FUNCTIONS, 0.2 A, FERRITE CHIP 1 FUNCTIONS, 0.05 A, FERRITE CHIP
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| File Size |
253.58K /
6 Page |
View
it Online |
Download Datasheet
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