| |
|
 |
Rochester Electronics LLC |
| Part No. |
TLC32044EFN
|
| Description |
TLC32044 - Voice-Band Analog Interface Circuits
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
LAPIS SEMICONDUCTOR CO LTD
OKI SEMICONDUCTOR CO., LTD.
OKI[OKI electronic componets]
OKI electronic components
|
| Part No. |
OL3204N-40 OL3201N-40
|
| Description |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1280-1330nm, THROUGH HOLE MOUNT, FC CONNECTOR
1.3 レm High-Power Laser-Diode DIP Module 1.3レ米高功率激光二极管双酯模块
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:4; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle 1.3レ米高功率激光二极管双酯模块
1.3 μm High-Power Laser-Diode DIP Module
1.3 m High-Power Laser-Diode DIP Module
|
| File Size |
49.81K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Rochester Electronics LLC |
| Part No. |
TLC32044IN
|
| Description |
TLC32044 - Voice-Band Analog Interface Circuits
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Rochester Electronics LLC |
| Part No. |
TLC32044IFK
|
| Description |
TLC32044 - Voice-Band Analog Interface Circuits
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54242-409081400LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54121-809081450LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-109081400LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54242-109081400LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-409081450LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
90814-0512 0908140512
|
| Description |
1.27mm (.050) Pitch Picoflex PF-50 Header, Vertical, Low Profile, Surface Mount, Tin, 12 Circuits
1.27mm (.050") Pitch Picoflex PF-50 Header, Vertical, Low Profile, Surface Mount, Tin, 12 Circuits
|
| File Size |
236.94K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-809081450LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
90814-0510 0908140510
|
| Description |
1.27mm (.050) Pitch Picoflex PF-50 Header, Vertical, Low Profile, Surface Mount, Tin, 10 Circuits
1.27mm (.050") Pitch Picoflex PF-50 Header, Vertical, Low Profile, Surface Mount, Tin, 10 Circuits
|
| File Size |
236.94K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54111-109081405LF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Stacking vertical header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
