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  90136-2109 Datasheet PDF File

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    ISL21090

Intersil Corporation
Part No. ISL21090
Description Ultra Low Noise, Precision Voltage Reference Output Current Capability 20mA

File Size 722.74K  /  10 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    5962-91613 5962-92109 5962-95645

International Rectifier
Part No. 5962-91613 5962-92109 5962-95645
Description 30W Total Output Power 28 Vin /-15 Vout Dual DC-DC Standard Converter in an ATW Package. DLA Number 5962-91613
30W Total Output Power 28 Vin /-12 Vout Dual DC-DC Standard Converter in an ATW Package. DLA Number 5962-92109
Hi-Rel DC-DC Standard Dual Converter in a ATW package

File Size 144.46K  /  8 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    IR21093S IR21093

International Rectifier
Part No. IR21093S IR21093
Description DUAL MOSFET DRIVER|CMOS|SOP|8PIN|PLASTIC
DUAL MOSFET DRIVER|CMOS|DIP|8PIN|PLASTIC
HALF-BRIDGE DRIVER

File Size 90.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Monolithic Power Systems, Inc.
Part No. EV2109DQ-00A
Description Dual 1.2MHz, 800mA Synchronous Step-Down Converter .2MHz的,800mA的同步降压转换器

File Size 292.08K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-109160800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MP2109DQ-00A

Monolithic Power Systems
Part No. MP2109DQ-00A
Description 1.2MHz Synchronous Step-Down Converter Evaluation Board

File Size 241.94K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    NMA-2101 NMA-2102 NMA-2103 NMA-2104 NMA-2105 NMA-2106 NMA-2107 NMA-2108 NMA-2109 NMA-2110

Micronetics, Inc.
Part No. NMA-2101 NMA-2102 NMA-2103 NMA-2104 NMA-2105 NMA-2106 NMA-2107 NMA-2108 NMA-2109 NMA-2110
Description NMA 2100 NOISE SOURCE SERIES

File Size 66.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-109121400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361105 90136-1105

Molex Electronics Ltd.
Part No. 0901361105 90136-1105
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109101700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0901361106 90136-1106

Molex Electronics Ltd.
Part No. 0901361106 90136-1106
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109201250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0901361103 90136-1103

Molex Electronics Ltd.
Part No. 0901361103 90136-1103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109721650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0901361102 90136-1102

Molex Electronics Ltd.
Part No. 0901361102 90136-1102
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 91931-32109LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Receptacle, Surface Mount, 9 Positions.
Tech specs    

Official Product Page

For 90136-2109 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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