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  90130-3318 Datasheet PDF File

For 90130-3318 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0901301318 90130-1318

Molex Electronics Ltd.
http://
Part No. 0901301318 90130-1318
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901301316 90130-1316

Molex Electronics Ltd.
http://
Part No. 0901301316 90130-1316
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901301344

Molex Electronics Ltd.
Part No. 0901301344
Description
File Size 168.73K  /  4 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901301350

Molex Electronics Ltd.
Part No. 0901301350
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901301312 90130-1312

Molex Electronics Ltd.
http://
Part No. 0901301312 90130-1312
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0901301310 90130-1310

Molex Electronics Ltd.
http://
Part No. 0901301310 90130-1310
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901303130

Molex Electronics Ltd.
Part No. 0901303130
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 30 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 55533-318
Description Minitek® 2.00mm, Board to Board Connector, Low Profile, PCB Mounted Receptacle , Vertical , Surface Mount, Top Entry, Double row, 18 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901301320

Molex Electronics Ltd.
Part No. 0901301320
Description
File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 63453-318LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131936</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, Minitek II VCC (HTP), PCB Mounted Receptacle , Vertical , Through Hole, Top Entry, Double row, 18 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901301130 90130-1130

Molex Electronics Ltd.
Part No. 0901301130 90130-1130
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-3318-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901301112 90130-1112

Molex Electronics Ltd.
Part No. 0901301112 90130-1112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 76383-318LF
Description Dubox®2.54mm, Board to Board Connector, Shrouded Header, Double Row, Right Angle.
Tech specs    

Official Product Page

For 90130-3318 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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