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  90130-3314 Datasheet PDF File

For 90130-3314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0901301312 90130-1312

Molex Electronics Ltd.
http://
Part No. 0901301312 90130-1312
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901301310 90130-1310

Molex Electronics Ltd.
http://
Part No. 0901301310 90130-1310
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901301320

Molex Electronics Ltd.
Part No. 0901301320
Description
File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901301130 90130-1130

Molex Electronics Ltd.
Part No. 0901301130 90130-1130
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901303130

Molex Electronics Ltd.
Part No. 0901303130
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 30 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.60K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0190130031

Molex Electronics Ltd.
Part No. 0190130031
Description InsulKrimp Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250) by0.81mm (.032), 14-16 AWG, Expanded Blue Insulator, Loose
MOLEX Connector

File Size 97.25K  /  2 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0190130029 190130029

Molex Electronics Ltd.
Part No. 0190130029 190130029
Description InsulKrimp Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250) by0.81mm (.032), 14-16 AWG, Blue Insulator, Tape
InsulKrimp垄芒 Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250") by0.81mm (.032"), 14-16 AWG, Blue Insulator, Tape
MOLEX Connector

File Size 107.35K  /  2 Page

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Amphenol Communications Solutions

Part No. 10131933-148ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 48 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    0901301134 90130-1134

Molex Electronics Ltd.
Part No. 0901301134 90130-1134
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 586.18K  /  7 Page

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Amphenol Communications Solutions

Part No. 69133-144HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901301136 90130-1136

Molex Electronics Ltd.
Part No. 0901301136 90130-1136
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 36 Circuits, Black, 3μm (118μ) Tin(Sn) over Nickel (Ni), Lead free

File Size 586.02K  /  7 Page

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Amphenol Communications Solutions

Part No. 78233-148HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901301138 90130-1138

Molex Electronics Ltd.
Part No. 0901301138 90130-1138
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.91K  /  7 Page

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Amphenol Communications Solutions

Part No. 10131933-140ALF
Description Minitek® 2.00mm, Board to Board, Receptacle, Surface Mount, Double row, 40 Positions, 2mm (0.079in), horizontal.
Tech specs    

Official Product Page

For 90130-3314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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