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  87834-3419 Datasheet PDF File

For 87834-3419 Found Datasheets File :: 136+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 |   

    0878342621 87834-2621

Molex Electronics Ltd.
Part No. 0878342621 87834-2621
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating
MOLEX Connector

File Size 124.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 94063-419HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878340841 87834-0841

Molex Electronics Ltd.
Part No. 0878340841 87834-0841
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 112.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-72LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions
Tech specs    

Official Product Page

    0878341017

Molex Electronics Ltd.
Part No. 0878341017
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, Gold (Au) Flash, Polyester Housing

File Size 104.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 68033-419HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    87834-5041 0878345041

Molex Electronics Ltd.
Part No. 87834-5041 0878345041
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 112.73K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-20LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 20 Positions
Tech specs    

Official Product Page

    87834-0811 0878340811

Molex Electronics Ltd.
Part No. 87834-0811 0878340811
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 8 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 68683-419LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 38 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87834-1821 0878341821

Molex Electronics Ltd.
Part No. 87834-1821 0878341821
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 69173-419HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
Tech specs    

Official Product Page

    87834-1811 0878341811

Molex Electronics Ltd.
Part No. 87834-1811 0878341811
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 18 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 59132-S34-19-092LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 38 Positions, 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    0878340419 87834-0419

Molex Electronics Ltd.
Part No. 0878340419 87834-0419
Description 2.54mm Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded 4 Circuits, 0.13μm Gold (Au) Plating, Black, without PCBLocator, without End

File Size 115.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs    

Official Product Page

    87834-4041 0878344041

Molex Electronics Ltd.
Part No. 87834-4041 0878344041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-10LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
Tech specs    

Official Product Page

    87834-6021 0878346021

Molex Electronics Ltd.
Part No. 87834-6021 0878346021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 59202-M34-19P110LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 38 Positions.
Tech specs    

Official Product Page

For 87834-3419 Found Datasheets File :: 136+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 |   

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