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  87834-0411 Datasheet PDF File

For 87834-0411 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0878343417 87834-3417

Molex Electronics Ltd.
Part No. 0878343417 87834-3417
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, Gold (Au) Flash, Polyester Housing

File Size 105.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137785-041132LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 4 Positions, GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-4013 0878344013

Molex Electronics Ltd.
Part No. 87834-4013 0878344013
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating

File Size 94.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137785-041121LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 4 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    0878343419 87834-3419

Molex Electronics Ltd.
Part No. 0878343419 87834-3419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132449-0411GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87834-4019 0878344019

Molex Electronics Ltd.
Part No. 87834-4019 0878344019
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 10127819-0411GLF
Description Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 4 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0878343421 87834-3421

http://
Molex Electronics Ltd.
Part No. 0878343421 87834-3421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.52K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137784-04112LF
Description Minitek® Pwr 4.2 HCC, Single Row, Right Angle Through Hole Header, Nylon 66, Tin plating, Natural Color, 4 Positions, Non GW Compatible, Tray packing.
Tech specs    

Official Product Page

    0878343441 87834-3441

Molex Electronics Ltd.
Part No. 0878343441 87834-3441
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating

File Size 113.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 68004-112HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    0878343492 87834-3492

Molex Electronics Ltd.
Part No. 0878343492 87834-3492
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows, with Pin 5 Voided

File Size 100.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 68004-114HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    0878343495 87834-3495

Molex Electronics Ltd.
Part No. 0878343495 87834-3495
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.69K  /  3 Page

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Amphenol Communications Solutions

Part No. 59453-041110EDHLF
Description 0.50mm Flex Connectors, FPC/FFC Side Entry ZIF Connector, Surface Mount, 4 Positions, Bottom Contact, 0.50mm (0.020in) Pitch.
Tech specs    

Official Product Page

    87834-1811 0878341811

Molex Electronics Ltd.
Part No. 87834-1811 0878341811
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 18 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. G874D04110PTEU
Description Mini power, Vertical, Dual row, 4.2mm pitch, 4 positions , 100u\\ Tin, 3.50mm tail length, LCP, Natural , TRAY
Tech specs    

Official Product Page

    0878345045 87834-5045

Molex Electronics Ltd.
Part No. 0878345045 87834-5045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13渭m (5渭) Gold (Au) Selective Plating

File Size 120.74K  /  3 Page

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Amphenol Communications Solutions

Part No. G8250041100YEU
Description Board mount - Header Receptacle - Pin Header 2.0mm Pitch Right Angel DIP,1x3Pin,Gold Flash,LCP,4.0mm*2.0mm*2.8mm,Color-Black,BAG
Tech specs    

Official Product Page

For 87834-0411 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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