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  87760-4416 Datasheet PDF File

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    0877601616 87760-1616

Molex Electronics Ltd.
Part No. 0877601616 87760-1616
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 68024-416HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877604816

Molex Electronics Ltd.
Part No. 0877604816
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 91614-416LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry, Single Row, 16 Position ,2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0877603017

Molex Electronics Ltd.
Part No. 0877603017
Description 2.00mm (.079) Pitch Milli-Grid?Header, Right Angle, Through Hole, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 68764-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877602017

Molex Electronics Ltd.
Part No. 0877602017
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 68004-416HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    0877604017

Molex Electronics Ltd.
Part No. 0877604017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 10154416-192SLF
Description M-SERIES 56, 1 MM Plug, 4-Pair, 20-Column, 260-PIN, 30u\\. Plating
Tech specs    

Official Product Page

    0877600616 87760-0616

Molex Electronics Ltd.
Part No. 0877600616 87760-0616
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
MOLEX Connector

File Size 155.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 74744-169LF
Description 5 Row Signal Header, Straight, STB, Wide body, 8 Mod
Tech specs    

Official Product Page

    0877601016 87760-1016

Molex Electronics Ltd.
Part No. 0877601016 87760-1016
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.54K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4416-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0877601017 87760-1017

Molex Electronics Ltd.
Part No. 0877601017 87760-1017
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 10 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4416-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0877600838 87760-0838

Molex Electronics Ltd.
Part No. 0877600838 87760-0838
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 8 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-f

File Size 155.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 68464-416HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87760-2816 0877602816

Molex Electronics Ltd.
Part No. 87760-2816 0877602816
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 93944-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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