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  87759-4415 Datasheet PDF File

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    87759-1664

Molex Electronics Ltd.
Part No. 87759-1664
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 420.97K  /  8 Page

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Texas Instruments
Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    87759-1250

Molex Electronics Ltd.
Part No. 87759-1250
Description
File Size 174.22K  /  4 Page

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Texas Instruments
Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87759-1464

Molex Electronics Ltd.
Part No. 87759-1464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 421.26K  /  8 Page

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Texas Instruments
Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

Official Product Page

    87759-1465

Molex Electronics Ltd.
Part No. 87759-1465
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,
File Size 280.39K  /  6 Page

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Amphenol Communications Solutions
Part No. 75844-156-40LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-7633

Molex Electronics Ltd.
Part No. 87759-7633
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap
File Size 355.89K  /  6 Page

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Amphenol Communications Solutions
Part No. 75844-156-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-4464

Molex Electronics Ltd.
Part No. 87759-4464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 421.15K  /  8 Page

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Amphenol Communications Solutions
Part No. 75844-156-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-1475

Molex Electronics Ltd.
Part No. 87759-1475
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 280.41K  /  6 Page

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Amphenol Communications Solutions
Part No. 75844-156-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-1476

Molex Electronics Ltd.
Part No. 87759-1476
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.83K  /  6 Page

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Amphenol Communications Solutions
Part No. 93944-415HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-1474

Molex Electronics Ltd.
Part No. 87759-1474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap
File Size 421.28K  /  8 Page

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Amphenol Communications Solutions
Part No. 75844-156-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87759-4876

Molex Electronics Ltd.
Part No. 87759-4876
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Amphenol Communications Solutions
Part No. 75844-150-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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