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  87758-1850 Datasheet PDF File

For 87758-1850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0877580817 87758-0817

Molex Electronics Ltd.
Part No. 0877580817 87758-0817
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079") Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.96K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-409481850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877580850 87758-0850

Molex Electronics Ltd.
Part No. 0877580850 87758-0850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 8 Circuits, 0.38um (15u) Gold (Au) Selective Plating
MOLEX Connector

File Size 135.96K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877581250 87758-1250

Molex Electronics Ltd.
Part No. 0877581250 87758-1250
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-809241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87758-2650 0877582650

Molex Electronics Ltd.
Part No. 87758-2650 0877582650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5045LF
Description SFP+ Cable Assembly, 24 AWG, 4.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    0877584416

Molex Electronics Ltd.
Part No. 0877584416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 44 Circuits

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5095LF
Description SFP+ Cable Assembly, 24 AWG, 9.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    0877584417

Molex Electronics Ltd.
Part No. 0877584417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 44 Circuits, 0.76um (30u) Gold (Au) Selective Plating

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5050HFLF
Description SFP+ Cable Assembly, 24 AWG, 5.0 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    0877583650 87758-3650

Molex Electronics Ltd.
Part No. 0877583650 87758-3650
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-110161850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580014 87758-0014

Molex Electronics Ltd.
Part No. 0877580014 87758-0014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 183.80K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-185-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs    

Official Product Page

    0877580617 87758-0617

Molex Electronics Ltd.
Part No. 0877580617 87758-0617
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 6 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109481850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580650 87758-0650

Molex Electronics Ltd.
Part No. 0877580650 87758-0650
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5015LF
Description SFP+ Cable Assembly, 24 AWG, 1.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

For 87758-1850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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