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  70567-0137 Datasheet PDF File

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    0015800205 15-80-0205 70567-0144

Molex Electronics Ltd.
Part No. 0015800205 15-80-0205 70567-0144
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-051131LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800207 15-80-0207 A-70567-0212

Molex Electronics Ltd.
Part No. 0015800207 15-80-0207 A-70567-0212
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating

File Size 1,218.31K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-031222LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    15-80-0087 0015800087 A-70567-0206

Molex Electronics Ltd.
Part No. 15-80-0087 0015800087 A-70567-0206
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.48K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-032221LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 3 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    0015800209 15-80-0209 A-70567-0280

Molex Electronics Ltd.
Part No. 0015800209 15-80-0209 A-70567-0280
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.34K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-052141LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    15-80-0085 0015800085 A-70567-0138

Molex Electronics Ltd.
Part No. 15-80-0085 0015800085 A-70567-0138
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.

File Size 1,218.46K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-052221LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    70567-0008 A-70567-0008 0015800201 15-80-0201

Molex Electronics Ltd.
Part No. 70567-0008 A-70567-0008 0015800201 15-80-0201
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-031242LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    70567-0009 0015800221

Molex Electronics Ltd.
Part No. 70567-0009 0015800221
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-042222LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 4 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    15-80-0069 0015800069 A-70567-0273

Molex Electronics Ltd.
Part No. 15-80-0069 0015800069 A-70567-0273
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-051241LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    A-70567-0285 15-80-0309 0015800309

Molex Electronics Ltd.
Part No. A-70567-0285 15-80-0309 0015800309
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.34K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-041132LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 4 Positions, GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    A-70567-0283 0015800269

Molex Electronics Ltd.
Part No. A-70567-0283 0015800269
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-031141LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 3 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

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