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  43045-1827 Datasheet PDF File

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    43045-1809

Molex Electronics Ltd.
Part No. 43045-1809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1808

Molex Electronics Ltd.
Part No. 43045-1808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1807

Molex Electronics Ltd.
Part No. 43045-1807
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1806

Molex Electronics Ltd.
Part No. 43045-1806
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits
File Size 184.21K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1802

Molex Electronics Ltd.
Part No. 43045-1802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1801

Molex Electronics Ltd.
Part No. 43045-1801
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-02LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 02 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1800

Molex Electronics Ltd.
Part No. 43045-1800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-12LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1209

Molex Electronics Ltd.
Part No. 43045-1209
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 12 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-418-27LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1208

Molex Electronics Ltd.
Part No. 43045-1208
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-22LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1201

Molex Electronics Ltd.
Part No. 43045-1201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-827-32LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

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