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  43045-1809 Datasheet PDF File

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    43045-2416

Molex Electronics Ltd.
Part No. 43045-2416
Description
File Size 174.08K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1615

Molex Electronics Ltd.
Part No. 43045-1615
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 16 Circuits
File Size 174.04K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-2415

Molex Electronics Ltd.
Part No. 43045-2415
Description
File Size 174.05K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-809282000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1206

Molex Electronics Ltd.
Part No. 43045-1206
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-809071800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1220

Molex Electronics Ltd.
Part No. 43045-1220
Description
File Size 175.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-118-09LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions
Tech specs 　 　

Official Product Page

    43045-1200

Molex Electronics Ltd.
Part No. 43045-1200
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-418-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1201

Molex Electronics Ltd.
Part No. 43045-1201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-809161550LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1208

Molex Electronics Ltd.
Part No. 43045-1208
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-105180950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    43045-1209

Molex Electronics Ltd.
Part No. 43045-1209
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 12 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 54111-809201800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1800

Molex Electronics Ltd.
Part No. 43045-1800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-809081450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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