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Molex Electronics Ltd.
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| Part No. |
22-28-3271 42225-0062 A-42225-0062
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| Description |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Polarizing Wall, 27 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 27 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
190.45K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77311-422-25LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
22-28-3274 42225-0167 A-42225-0167
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| Description |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Polarizing Wall, 27 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Kinked PC Tails
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 27 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails
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| File Size |
190.47K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10134040-22000LF
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| Description |
HPCE CTB VT HEADER 4LP With latch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
22-28-3278 42225-0307 A-42225-0307
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| Description |
2.54mm (.100) Pitch KK庐 Header, Breakaway, Vertical, with Polarizing Wall, 27 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, with Backwalls Removed
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 27 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Backwalls Removed
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| File Size |
190.51K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68002-201HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-203HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-207HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-802200800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
84502-201
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| Description |
300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
94050-220CALF
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| Description |
Assembly, Top Mount, D/D(136Pins), R/A, 5V, 2mm s/o, Right Push Rod Eject, 8mm Card Travel, Narrow Body
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
470-2205-100
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| Description |
Receptacle. mod,20Positions, 20.5mm, NEXLEV
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-802-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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